The Zilog Z8 is a microcontroller architecture, originally introduced by Zilog in 1979. Today the line also includes the Z8 Encore! , eZ8 Encore! , eZ8 Encore! XP , and eZ8 Encore! MC families.
69-973: Signifying features of the architecture are up to 4,096 fast on-chip registers which may be used as accumulators, pointers, or as ordinary random-access memory (RAM). A 16-bit address space for between 1 kibibyte (KB) and 64 KB of either programmable read-only memory (PROM, OTP), read-only memory (ROM), or flash memory , are used to store code and constants, and there is a second 16-bit address space which can be used for large applications. On chip peripherals include analog-to-digital converter (A/D), Serial Peripheral Interface (SPI) and Inter-Integrated Circuit ( I²C ) channels, IrDA encoders/decoders etc. There are versions with from 8 up to 80 pins, housed in dual in-line package (PDIP), Quad Flat No-leads package (MicroLeadFrame, MLF), small outline integrated circuit (SOIC), Shrink Small-Outline Package (SSOP), and low profile Quad Flat Package (LQFP). The eZ8 Encore! series can be programmed and debugged through
138-478: A 3 μm process . The HM6147 chip was able to match the performance of the fastest NMOS memory chip at the time, while the HM6147 also consumed significantly less power. With comparable performance and much less power consumption, the twin-well CMOS process eventually overtook NMOS as the most common semiconductor manufacturing process for computer memory in the 1980s. The two most common types of DRAM memory cells since
207-550: A few dozen or few hundred bits of such memory could be provided. The first practical form of random-access memory was the Williams tube . It stored data as electrically charged spots on the face of a cathode-ray tube . Since the electron beam of the CRT could read and write the spots on the tube in any order, memory was random access. The capacity of the Williams tube was a few hundred to around
276-467: A hard drive. This entire pool of memory may be referred to as "RAM" by many developers, even though the various subsystems can have very different access times , violating the original concept behind the random access term in RAM. Even within a hierarchy level such as DRAM, the specific row, column, bank, rank , channel, or interleave organization of the components make the access time variable, although not to
345-424: A memory capacity that is a power of two. Usually several memory cells share the same address. For example, a 4 bit "wide" RAM chip has four memory cells for each address. Often the width of the memory and that of the microprocessor are different, for a 32 bit microprocessor, eight 4 bit RAM chips would be needed. Often more addresses are needed than can be provided by a device. In that case, external multiplexors to
414-404: A portion of a computer's RAM, allowing it to act as a much faster hard drive that is called a RAM disk . A RAM disk loses the stored data when the computer is shut down, unless memory is arranged to have a standby battery source, or changes to the RAM disk are written out to a nonvolatile disk. The RAM disk is reloaded from the physical disk upon RAM disk initialization. Sometimes, the contents of
483-551: A relatively slow ROM chip are copied to read/write memory to allow for shorter access times. The ROM chip is then disabled while the initialized memory locations are switched in on the same block of addresses (often write-protected). This process, sometimes called shadowing , is fairly common in both computers and embedded systems . As a common example, the BIOS in typical personal computers often has an option called "use shadow BIOS" or similar. When enabled, functions that rely on data from
552-529: A single MOS transistor per capacitor. The first commercial DRAM IC chip, the 1K Intel 1103 , was introduced in October 1970. Synchronous dynamic random-access memory (SDRAM) was reintroduced with the Samsung KM48SL2000 chip in 1992. Early computers used relays , mechanical counters or delay lines for main memory functions. Ultrasonic delay lines were serial devices which could only reproduce data in
621-462: A single pin serial communication interface. The basic architecture, a modified (non-strict) Harvard architecture , is technically very different from the Zilog Z80 . Despite this, the instruction set and assembly language syntax are quite similar to other Zilog processors: Load/store operations use the same LD mnemonic (no MOV or MOVE s), typifying instructions such as DJNZ , are
690-493: A single-transistor DRAM memory cell. In 1967, Dennard filed a patent for a single-transistor DRAM memory cell, based on MOS technology. The first commercial bipolar 64-bit SRAM was released by Intel in 1969 with the 3101 Schottky TTL . One year later, it released the first DRAM integrated circuit chip, the Intel 1103 , based on MOS technology. By 1972, it beat previous records in semiconductor memory sales. DRAM chips during
759-491: A switch that lets the control circuitry on the chip read the capacitor's state of charge or change it. As this form of memory is less expensive to produce than static RAM, it is the predominant form of computer memory used in modern computers. Both static and dynamic RAM are considered volatile , as their state is lost or reset when power is removed from the system. By contrast, read-only memory (ROM) stores data by permanently enabling or disabling selected transistors, such that
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#1732858396633828-593: A thousand bits, but it was much smaller, faster, and more power-efficient than using individual vacuum tube latches. Developed at the University of Manchester in England, the Williams tube provided the medium on which the first electronically stored program was implemented in the Manchester Baby computer, which first successfully ran a program on 21 June, 1948. In fact, rather than the Williams tube memory being designed for
897-615: Is a type of flip-flop circuit, usually implemented using FETs . This means that SRAM requires very low power when not being accessed, but it is expensive and has low storage density. A second type, DRAM, is based around a capacitor. Charging and discharging this capacitor can store a "1" or a "0" in the cell. However, the charge in this capacitor slowly leaks away, and must be refreshed periodically. Because of this refresh process, DRAM uses more power, but it can achieve greater storage densities and lower unit costs compared to SRAM. To be useful, memory cells must be readable and writable. Within
966-420: Is always available for reading as an output. The value remains stored until it is changed through the set or reset process. Flip-flops are typically implemented using MOSFETs . Floating-gate memory cells, based on floating-gate MOSFETs , are used for most non-volatile memory (NVM) technologies, including EPROM , EEPROM and flash memory . According to R. Bez and A. Pirovano: A floating-gate memory cell
1035-444: Is basically an MOS transistor with a gate completely surrounded by dielectrics (Fig. 1.2), the floating-gate (FG), and electrically governed by a capacitive-coupled control-gate (CG). Being electrically isolated, the FG acts as the storing electrode for the cell device. Charge injected into the FG is maintained there, allowing modulation of the ‘apparent’ threshold voltage (i.e. VT seen from
1104-493: Is built mainly out of DRAM cells; since the layout is much smaller than SRAM, it can be more densely packed yielding cheaper memory with greater capacity. Since the DRAM memory cell stores its value as the charge of a capacitor, and there are current leakage issues, its value must be constantly rewritten. This is one of the reasons that make DRAM cells slower than the larger SRAM (static RAM) cells, which has its value always available. That
1173-403: Is far more expensive than the dynamic RAM used for larger memories. Static RAM also consumes far more power. CPU speed improvements slowed significantly partly due to major physical barriers and partly because current CPU designs have already hit the memory wall in some sense. Intel summarized these causes in a 2005 document. First of all, as chip geometries shrink and clock frequencies rise,
1242-465: Is more expensive to produce, but is generally faster and requires less dynamic power than DRAM. In modern computers, SRAM is often used as cache memory for the CPU . DRAM stores a bit of data using a transistor and capacitor pair (typically a MOSFET and MOS capacitor , respectively), which together comprise a DRAM cell. The capacitor holds a high or low charge (1 or 0, respectively), and the transistor acts as
1311-489: Is reduced by the size of the shadowed ROMs. The ' memory wall is the growing disparity of speed between CPU and the response time of memory (known as memory latency ) outside the CPU chip. An important reason for this disparity is the limited communication bandwidth beyond chip boundaries, which is also referred to as bandwidth wall . From 1986 to 2000, CPU speed improved at an annual rate of 55% while off-chip memory response time only improved at 10%. Given these trends, it
1380-539: Is the basis for modern DRAM. In 1966, Robert H. Dennard at the IBM Thomas J. Watson Research Center was working on MOS memory. While examining the characteristics of MOS technology, he found it was capable of building capacitors , and that storing a charge or no charge on the MOS capacitor could represent the 1 and 0 of a bit, while the MOS transistor could control writing the charge to the capacitor. This led to his development of
1449-530: Is the fundamental building block of computer memory . The memory cell is an electronic circuit that stores one bit of binary information and it must be set to store a logic 1 ( high voltage level) and reset to store a logic 0 (low voltage level). Its value is maintained/stored until it is changed by the set/reset process. The value in the memory cell can be accessed by reading it. Over the history of computing , different memory cell architectures have been used, including core memory and bubble memory . Today ,
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#17328583966331518-423: Is the processor-memory performance gap, which can be addressed by 3D integrated circuits that reduce the distance between the logic and memory aspects that are further apart in a 2D chip. Memory subsystem design requires a focus on the gap, which is widening over time. The main method of bridging the gap is the use of caches ; small amounts of high-speed memory that houses recent operations and instructions nearby
1587-503: Is the reason why SRAM memory is used for on- chip cache included in modern microprocessor chips. On December 11, 1946 Freddie Williams applied for a patent on his cathode-ray tube (CRT) storing device ( Williams tube ) with 128 40- bit words. It was operational in 1947 and is considered the first practical implementation of random-access memory (RAM). In that year, the first patent applications for magnetic-core memory were filed by Frederick Viehe. Practical magnetic-core memory
1656-524: The Atanasoff–Berry Computer , the Williams tube and the Selectron tube . In 1966, Robert Dennard invented modern DRAM architecture for which there is a single MOS transistor per capacitor. While examining the characteristics of MOS technology, he found it was capable of building capacitors , and that storing a charge or no charge on the MOS capacitor could represent the 1 and 0 of a bit, while
1725-754: The Motorola 6800 , 6809 based Motorola 68HC11 , the Hitachi H8 family, and Z80 -derivatives, such as Toshiba TLCS-870, to name only a few. JTCEMU is a free software ( GNU General Public License (GPL) version 3) Z8 emulator written in Java for Linux , Windows , and macOS . Random-access memory Random-access memory ( RAM ; / r æ m / ) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code . A random-access memory device allows data items to be read or written in almost
1794-432: The 1960s with bipolar memory, which used bipolar transistors . Although it was faster, it could not compete with the lower price of magnetic core memory. In 1957, Frosch and Derick manufactured the first silicon dioxide field-effect transistors at Bell Labs, the first transistors in which drain and source were adjacent at the surface. Subsequently, in 1960, a team demonstrated a working MOSFET at Bell Labs. This led to
1863-536: The 1980s have been trench-capacitor cells and stacked-capacitor cells. Trench-capacitor cells are where holes (trenches) are made in a silicon substrate, whose side walls are used as a memory cell, whereas stacked-capacitor cells are the earliest form of three-dimensional memory (3D memory), where memory cells are stacked vertically in a three-dimensional cell structure. Both debuted in 1984, when Hitachi introduced trench-capacitor memory and Fujitsu introduced stacked-capacitor memory. The floating-gate MOSFET (FGMOS)
1932-501: The BIOS's ROM instead use DRAM locations (most can also toggle shadowing of video card ROM or other ROM sections). Depending on the system, this may not result in increased performance, and may cause incompatibilities. For example, some hardware may be inaccessible to the operating system if shadow RAM is used. On some systems the benefit may be hypothetical because the BIOS is not used after booting in favor of direct hardware access. Free memory
2001-540: The Baby, the Baby was a testbed to demonstrate the reliability of the memory. Magnetic-core memory was invented in 1947 and developed up until the mid-1970s. It became a widespread form of random-access memory, relying on an array of magnetized rings. By changing the sense of each ring's magnetization, data could be stored with one bit stored per ring. Since every ring had a combination of address wires to select and read or write it, access to any memory location in any sequence
2070-402: The MOS transistor could control writing the charge to the capacitor. This led to his development of a single-transistor DRAM memory cell. In 1967, Dennard filed a patent under IBM for a single-transistor DRAM memory cell, based on MOS technology. The first commercial DRAM IC chip was the Intel 1103 , which was manufactured on an 8 μm MOS process with a capacity of 1 kbit , and
2139-486: The RAM comes in an easily upgraded form of modules called memory modules or DRAM modules about the size of a few sticks of chewing gum. These can be quickly replaced should they become damaged or when changing needs demand more storage capacity. As suggested above, smaller amounts of RAM (mostly SRAM) are also integrated in the CPU and other ICs on the motherboard , as well as in hard-drives, CD-ROMs , and several other parts of
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2208-444: The RAM device, multiplexing and demultiplexing circuitry is used to select memory cells. Typically, a RAM device has a set of address lines A 0 , A 1 , . . . A n {\displaystyle A_{0},A_{1},...A_{n}} , and for each combination of bits that may be applied to these lines, a set of memory cells are activated. Due to this addressing, RAM devices virtually always have
2277-575: The SP95 memory chip for the System/360 Model 95 . Dynamic random-access memory (DRAM) allowed replacement of a 4 or 6-transistor latch circuit by a single transistor for each memory bit, greatly increasing memory density at the cost of volatility. Data was stored in the tiny capacitance of each transistor, and had to be periodically refreshed every few milliseconds before the charge could leak away. Toshiba 's Toscal BC-1411 electronic calculator , which
2346-405: The computer system. In addition to serving as temporary storage and working space for the operating system and applications, RAM is used in numerous other ways. Most modern operating systems employ a method of extending RAM capacity, known as "virtual memory". A portion of the computer's hard drive is set aside for a paging file or a scratch partition , and the combination of physical RAM and
2415-448: The development of metal–oxide–semiconductor (MOS) memory by John Schmidt at Fairchild Semiconductor in 1964. In addition to higher speeds, MOS semiconductor memory was cheaper and consumed less power than magnetic core memory. The development of silicon-gate MOS integrated circuit (MOS IC) technology by Federico Faggin at Fairchild in 1968 enabled the production of MOS memory chips . MOS memory overtook magnetic core memory as
2484-408: The device are used to activate the correct device that is being accessed. RAM is often byte addressable, although it is also possible to make RAM that is word-addressable. One can read and over-write data in RAM. Many computer systems have a memory hierarchy consisting of processor registers , on- die SRAM caches, external caches , DRAM , paging systems and virtual memory or swap space on
2553-437: The dominant memory technology in the early 1970s. Integrated bipolar static random-access memory (SRAM) was invented by Robert H. Norman at Fairchild Semiconductor in 1963. It was followed by the development of MOS SRAM by John Schmidt at Fairchild in 1964. SRAM became an alternative to magnetic-core memory, but required six MOS transistors for each bit of data. Commercial use of SRAM began in 1965, when IBM introduced
2622-447: The early 1970s had three-transistor cells, before single-transistor cells became standard since the mid-1970s. CMOS memory was commercialized by RCA , which launched a 288-bit CMOS SRAM memory chip in 1968. CMOS memory was initially slower than NMOS memory, which was more widely used by computers in the 1970s. In 1978, Hitachi introduced the twin-well CMOS process, with its HM6147 (4 kb SRAM) memory chip, manufactured with
2691-410: The extent that access time to rotating storage media or a tape is variable. The overall goal of using a memory hierarchy is to obtain the fastest possible average access time while minimizing the total cost of the entire memory system (generally, the memory hierarchy follows the access time with the fast CPU registers at the top and the slow hard drive at the bottom). In many modern personal computers,
2760-437: The first 64-bit p-channel MOS ( PMOS ) static random-access memory (SRAM). SRAM typically has six- transistor cells, whereas DRAM (dynamic random-access memory) typically has single-transistor cells. In 1965, Toshiba 's Toscal BC-1411 electronic calculator used a form of capacitive bipolar DRAM, storing 180-bit data on discrete memory cells, consisting of germanium bipolar transistors and capacitors. MOS technology
2829-537: The first silicon dioxide field effect transistors at Bell Labs, the first transistors in which drain and source were adjacent at the surface. Subsequently, a team demonstrated a working MOSFET at Bell Labs 1960. The invention of the MOSFET enabled the practical use of metal–oxide–semiconductor (MOS) transistors as memory cell storage elements, a function previously served by magnetic cores . The first modern memory cells were introduced in 1964, when John Schmidt designed
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2898-696: The form of integrated circuit (IC) chips with MOS (metal–oxide–semiconductor) memory cells . RAM is normally associated with volatile types of memory where stored information is lost if power is removed. The two main types of volatile random-access semiconductor memory are static random-access memory (SRAM) and dynamic random-access memory (DRAM). Non-volatile RAM has also been developed and other types of non-volatile memories allow random access for read operations, but either do not allow write operations or have other kinds of limitations. These include most types of ROM and NOR flash memory . The use of semiconductor RAM dates back to 1965 when IBM introduced
2967-412: The fundamental building block of computer memory . The memory cell is an electronic circuit that stores one bit of binary information and it must be set to store a logic 1 (high voltage level) and reset to store a logic 0 (low voltage level). Its value is maintained/stored until it is changed by the set/reset process. The value in the memory cell can be accessed by reading it. In SRAM, the memory cell
3036-530: The gap between RAM and hard disk speeds, although RAM continues to be an order of magnitude faster, with single-lane DDR5 8000MHz capable of 128 GB/s, and modern GDDR even faster. Fast, cheap, non-volatile solid state drives have replaced some functions formerly performed by RAM, such as holding certain data for immediate availability in server farms - 1 terabyte of SSD storage can be had for $ 200, while 1 TB of RAM would cost thousands of dollars. Memory cell (computing) The memory cell
3105-513: The implementation technology used, the purpose of the binary memory cell is always the same. It stores one bit of binary information that can be accessed by reading the cell and it must be set to store a 1 and reset to store a 0. Logic circuits without memory cells are called combinational , meaning the output depends only on the present input. But memory is a key element of digital systems . In computers, it allows to store both programs and data and memory cells are also used for temporary storage of
3174-541: The means of producing inductance within solid state devices, resistance-capacitance (RC) delays in signal transmission are growing as feature sizes shrink, imposing an additional bottleneck that frequency increases don't address. The RC delays in signal transmission were also noted in "Clock Rate versus IPC: The End of the Road for Conventional Microarchitectures" which projected a maximum of 12.5% average annual CPU performance improvement between 2000 and 2014. A different concept
3243-436: The memory cannot be altered. Writable variants of ROM (such as EEPROM and NOR flash ) share properties of both ROM and RAM, enabling data to persist without power and to be updated without requiring special equipment. ECC memory (which can be either SRAM or DRAM) includes special circuitry to detect and/or correct random faults (memory errors) in the stored data, using parity bits or error correction codes . In general,
3312-467: The monolithic (single-chip) 16-bit SP95 SRAM chip for their System/360 Model 95 computer, and Toshiba used bipolar DRAM memory cells for its 180-bit Toscal BC-1411 electronic calculator , both based on bipolar transistors . While it offered higher speeds than magnetic-core memory , bipolar DRAM could not compete with the lower price of the then-dominant magnetic-core memory. In 1966, Dr. Robert Dennard invented modern DRAM architecture in which there's
3381-424: The most common memory cell architecture is MOS memory , which consists of metal–oxide–semiconductor (MOS) memory cells. Modern random-access memory (RAM) uses MOS field-effect transistors (MOSFETs) as flip-flops, along with MOS capacitors for certain types of RAM. The SRAM ( static RAM ) memory cell is a type of flip-flop circuit, typically implemented using MOSFETs. These require very low power to maintain
3450-443: The order it was written. Drum memory could be expanded at relatively low cost but efficient retrieval of memory items requires knowledge of the physical layout of the drum to optimize speed. Latches built out of triode vacuum tubes , and later, out of discrete transistors , were used for smaller and faster memories such as registers . Such registers were relatively large and too costly to use for large amounts of data; generally only
3519-517: The other hand, is based on floating-gate memory cell architectures. Non-volatile memory technologies such as EPROM , EEPROM , and flash memory utilize floating-gate memory cells, which rely on floating-gate MOSFET transistors. The memory cell is the fundamental building block of memory. It can be implemented using different technologies, such as bipolar , MOS , and other semiconductor devices . It can also be built from magnetic material such as ferrite cores or magnetic bubbles. Regardless of
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#17328583966333588-506: The output of combinational circuits to be used later by digital systems. Logic circuits that use memory cells are called sequential circuits , meaning the output depends not only on the present input, but also on the history of past inputs. This dependence on the history of past inputs makes these circuits stateful and it is the memory cells that store this state. These circuits require a timing generator or clock for their operation. Computer memory used in most contemporary computer systems
3657-571: The paging file form the system's total memory. (For example, if a computer has 2 GB (1024 B) of RAM and a 1 GB page file, the operating system has 3 GB total memory available to it.) When the system runs low on physical memory, it can " swap " portions of RAM to the paging file to make room for new data, as well as to read previously swapped information back into RAM. Excessive use of this mechanism results in thrashing and generally hampers overall system performance, mainly because hard drives are far slower than RAM. Software can "partition"
3726-577: The processor, speeding up the execution of those operations or instructions in cases where they are called upon frequently. Multiple levels of caching have been developed to deal with the widening gap, and the performance of high-speed modern computers relies on evolving caching techniques. There can be up to a 53% difference between the growth in speed of processor and the lagging speed of main memory access. Solid-state hard drives have continued to increase in speed, from ~400 Mbit/s via SATA3 in 2012 up to ~7 GB/s via NVMe / PCIe in 2024, closing
3795-455: The same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks and magnetic tape ), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement. In today's technology, random-access memory takes
3864-435: The same type, simply because it takes longer for signals to traverse a larger circuit. Constructing a memory unit of many gibibytes with a response time of one clock cycle is difficult or impossible. Today's CPUs often still have a mebibyte of 0 wait state cache memory, but it resides on the same chip as the CPU cores due to the bandwidth limitations of chip-to-chip communication. It must also be constructed from static RAM, which
3933-543: The same, and so on. An integrated development environment (IDE) named Zilog Developer's Studio (ZDS) can be downloaded from Zilog's website including an assembler. The edition of ZDS II targeting Z8 Encore! and newer derivatives also includes a free compiler claiming ANSI C89 compliance. Primary competitors include the somewhat similar Microchip Technology PIC family, and all Intel 8051 descendants. Also more traditional von Neumann architecture based single chip microcontrollers may be regarded as competitors, such as
4002-424: The stored value when not being accessed. A second type, DRAM ( dynamic RAM ), is based on MOS capacitors. Charging and discharging a capacitor can store either a '1' or a '0' in the cell. However, since the charge in the capacitor slowly dissipates, it must be refreshed periodically. Due to this refresh process, DRAM consumes more power, but it can achieve higher storage densities. Most non-volatile memory (NVM), on
4071-400: The term RAM refers solely to solid-state memory devices (either DRAM or SRAM), and more specifically the main memory in most computers. In optical storage, the term DVD-RAM is somewhat of a misnomer since, it is not random access; it behaves much like a hard disc drive if somewhat slower. Aside, unlike CD-RW or DVD-RW , DVD-RAM does not need to be erased before reuse. The memory cell is
4140-558: The transistor leakage current increases, leading to excess power consumption and heat... Secondly, the advantages of higher clock speeds are in part negated by memory latency, since memory access times have not been able to keep pace with increasing clock frequencies. Third, for certain applications, traditional serial architectures are becoming less efficient as processors get faster (due to the so-called von Neumann bottleneck ), further undercutting any gains that frequency increases might otherwise buy. In addition, partly due to limitations in
4209-494: Was Samsung's 64 Mbit DDR SDRAM chip, released in June 1998. GDDR (graphics DDR) is a form of DDR SGRAM (synchronous graphics RAM), which was first released by Samsung as a 16 Mbit memory chip in 1998. The two widely used forms of modern RAM are static RAM (SRAM) and dynamic RAM (DRAM). In SRAM, a bit of data is stored using the state of a six- transistor memory cell , typically using six MOSFETs. This form of RAM
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#17328583966334278-539: Was developed by An Wang in 1948, and improved by Jay Forrester and Jan A. Rajchman in the early 1950s, before being commercialised with the Whirlwind computer in 1953. Ken Olsen also contributed to its development. Semiconductor memory began in the early 1960s with bipolar memory cells, made of bipolar transistors . While it improved performance, it could not compete with the lower price of magnetic-core memory. In 1957, Frosch and Derick were able to manufacture
4347-490: Was expected that memory latency would become an overwhelming bottleneck in computer performance. Another reason for the disparity is the enormous increase in the size of memory since the start of the PC revolution in the 1980s. Originally, PCs contained less than 1 mebibyte of RAM, which often had a response time of 1 CPU clock cycle, meaning that it required 0 wait states. Larger memory units are inherently slower than smaller ones of
4416-408: Was first announced by Toshiba in 2007, and first commercially manufactured by Samsung Electronics in 2013. The following schematics detail the three most used implementations for memory cells: The flip-flop has many different implementations, its storage element is usually a latch consisting of a NAND gate loop or a NOR gate loop with additional gates used to implement clocking. Its value
4485-410: Was introduced in 1965, used a form of capacitor-bipolar DRAM, storing 180-bit data on discrete memory cells , consisting of germanium bipolar transistors and capacitors. While it offered higher speeds than magnetic-core memory, bipolar DRAM could not compete with the lower price of the then dominant magnetic-core memory. Capacitors had also been used for earlier memory schemes, such as the drum of
4554-453: Was invented by Dawon Kahng and Simon Sze at Bell Labs in 1967. They proposed the concept of floating-gate memory cells, using FGMOS transistors, which could be used to produce reprogrammable ROM (read-only memory). Floating-gate memory cells later became the basis for non-volatile memory (NVM) technologies including EPROM (erasable programmable ROM), EEPROM (electrically erasable programmable ROM) and flash memory . Flash memory
4623-436: Was invented by Fujio Masuoka at Toshiba in 1980. Masuoka and his colleagues presented the invention of NOR flash in 1984, and then NAND flash in 1987. Multi-level cell (MLC) flash memory was introduced by NEC , which demonstrated quad-level cells in a 64 Mb flash chip storing 2-bit per cell in 1996. 3D V-NAND , where flash memory cells are stacked vertically using 3D charge trap flash (CTP) technology,
4692-460: Was possible. Magnetic core memory was the standard form of computer memory until displaced by semiconductor memory in integrated circuits (ICs) during the early 1970s. Prior to the development of integrated read-only memory (ROM) circuits, permanent (or read-only ) random-access memory was often constructed using diode matrices driven by address decoders , or specially wound core rope memory planes. Semiconductor memory appeared in
4761-433: Was released in 1970. The earliest DRAMs were often synchronized with the CPU clock (clocked) and were used with early microprocessors. In the mid-1970s, DRAMs moved to the asynchronous design, but in the 1990s returned to synchronous operation. In 1992 Samsung released KM48SL2000, which had a capacity of 16 Mbit . and mass-produced in 1993. The first commercial DDR SDRAM ( double data rate SDRAM) memory chip
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