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42-528: The platform was created after December 12, 2002, as STMicroelectronics and Texas Instruments jointly announced an initiative for Open Mobile Application Processor Interfaces (OMAPI) intended to be used with 2.5 and 3G mobile phones , that were going to be produced during 2003. (This was later merged into a larger initiative and renamed the MIPI Alliance .) The OMAP was Texas Instruments' implementation of this standard. (The STMicroelectronics implementation

84-516: A PowerVR SGX540 graphics processing unit (GPU) . The 4430's GPU runs at a clock frequency of 304 Mhz, and the 4460's GPU runs at 384 MHz. The 4470 has a PowerVR SGX544 GPU that supports DirectX 9 that enables it for use in Windows 8 . It also has a dedicated 2D graphics core for increased power efficiency up to 50-90%. The 5th generation OMAP, OMAP 5 SoC uses a dual-core ARM Cortex-A15 CPU with two additional Cortex-M4 cores to offload

126-498: A SATA 2.0 controller. These are marketed only to handset manufacturers. They are intended to be highly integrated, low cost chips for consumer products. The OMAP-DM series are intended to be used as digital media coprocessors for mobile devices with high megapixel digital still and video cameras. These OMAP-DM chips incorporate both an ARM processor and an Image Signal Processor (ISP) to accelerate processing of camera images. These are marketed only to handset manufacturers. Many of

168-609: A TI-enhanced ARM925 core (ARM925T), and then changed to a standard ARM926 core. It included many variants, most easily distinguished according to manufacturing technology ( 130 nm except for the OMAP171x series), CPU, peripheral set, and distribution channel (direct to large handset vendors, or through catalog-based distributors). In March 2009, the OMAP1710 family chips are still available to handset vendors. Products using OMAP 1 processors include hundreds of cell phone models, and

210-449: A common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET , the R&;D center of French telecom company France Telecom . The 200 mm (8 in) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1

252-400: A former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The original 100 mm (4 in) fab was upgraded into 130 mm (5 in) and later 150 mm (6 in) fab in 1996. It is now being shut down. The site also has a "Wafer Level Chip Scale Packaging" accreditation for eSIM ICs. In 1988,

294-576: A radiofrequency products facility, the Bouskoura site now hosts back-end manufacturing activity, which includes chip testing and packaging. Since 2022 it also features a production line for silicon carbide products that primarily will be used in electric vehicles. The Norrköping plant is a wafer fab that, at the start of production in 2021, was the first to produce 200mm (8 in) Silicone Carbide wafers. The wafers are mostly used for SiC power devices. The Phoenix , Arizona 8 inch (200 mm) fab,

336-425: A significant performance advantage over Nvidia Tegra 2's ARM Cortex-A9s with non-vector floating point units. It also uses a dual-channel LPDDR2 memory controller compared to Nvidia Tegra 2's single-channel memory controller. All OMAP 4 processors come with an IVA3 multimedia hardware accelerator with a programmable DSP that enables 1080p Full HD and multi-standard video encoding and decoding. The 4430 and 4460 use

378-514: A small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus ), which became a leader in the smartcard industry. Employing 1,500 staff, this site hosts a fab and R&D centers. Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza employs around 4,000 staff and

420-516: Is a 45 nm version of the 65 nm OMAP34x with higher clock speed. The OMAP 3611 found in devices like the Bookeen's Cybook Odyssey is a licensed crippled version of the OMAP 3621, both are the same silicon (as marking are the same) but officially the 3611 was sold to be only able to drive e-Ink screen and does not have access to IVA & DSP. The video technology in the higher end OMAP 3 parts

462-606: Is a European multinational semiconductor contract manufacturing and design company. It is the largest of such companies in Europe . It was founded in 1987 from the merger of two state-owned semiconductor corporations: Thomson Semiconducteurs of France and SGS Microelettronica of Italy . The company is incorporated in the Netherlands and headquartered in Plan-les-Ouates , Switzerland . Its shares are traded on Euronext Paris ,

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504-601: Is a historical base of the company (ex SGS). The site has several fab lines (including a 300 mm (12 in) fab) and an R&D center. Castelletto , employs 300 to 400 staff and hosts some divisions and R&D centers. Update-2012: Numonyx JV (with Intel) is acquired by Micron. As such, R2 Fab (Agrate previous R&D 200-mm Fab) is currently a Micron entity The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs . The plant

546-571: Is derived in part from the DaVinci product line, which first packaged higher end C64x+ DSPs and image processing controllers with ARM9 processors last seen in the older OMAP 1 generation or ARM Cortex-A8. Not highlighted in the list below is that each OMAP 3 SoC has an "Image, Video, Audio" (IVA2) accelerator. These units do not all have the same capabilities. Most devices support 12 megapixel camera images, though some support 5 or 3 megapixels. Some support HD imaging. The OMAP 4 line consists of

588-418: Is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development. The Crolles site hosts a 200 mm (8 in) and a 300 mm (12 in) fab and was originally built as

630-673: Is use of a floating point DSP, instead of the more customary fixed point one. The Hawkboard uses the OMAP-L138 Many mobile phones released during early 21st century have used OMAP SoCs, including the Nokia 3230, N9, N90, N91, N92, N95, N82, E61, E62, E63 and E90 mobile phones, as well as the Nokia 770, N800, N810 and N900 Internet tablets , Motorola Droid , Droid X , and Droid 2 , and some early Samsung Galaxy devices, like Samsung Galaxy Tab 2 7.0 and Galaxy S II variant GT-I9100G. The OMAP3430

672-532: Is used in the Palm Pre , Pandora , and Touch Book . Other devices that use OMAP processors include Sony Ericsson's Satio (Idou) and Vivaz , most Samsung phones running Symbian (including Omnia HD ), the Nook Color , some Archos tablets (such as Archos 80 gen 9 and Archos 101 gen 9), Kindle Fire HD , Blackberry Playbook , Kobo Arc , and B&N Nook HD . Some all-in-one smart displays use OMAP 4 SoCs, including

714-569: The Borsa Italiana and the New York Stock Exchange . ST was formed in 1987 by the merger of two government-owned semiconductor companies: Italian SGS Microelettronica (where SGS stands for Società Generale Semiconduttori , "General Semiconductor Company"), and French Thomson Semiconducteurs , the semiconductor arm of Thomson . SGS Microelettronica originated in 1972 from a previous merger of two companies: Thomson Semiconducteurs

756-510: The Carrollton , Texas 6 inch (150 mm) fab, and the Ain Sebaa , Morocco fab are beginning rampdown plans, and are destined to close by 2010. The Casablanca , Morocco site consists of two assembly parts (Bouskoura and Aïn Sebaâ) and totals around 4000 employees. It was opened in the 1960s by Thomson. The Bristol , United Kingdom site employing well over 300 at its peak (in 2001/2) but

798-670: The Nokia 770 Internet tablets . These parts were only marketed to handset vendors. Products using these include both Internet tablets and mobile phones : The 3rd generation OMAP, the OMAP ;3 is broken into 3 distinct groups: the OMAP34x, the OMAP35x, and the OMAP36x. OMAP34x and OMAP36x are distributed directly to large handset (such as cell phone) manufacturers. OMAP35x is a variant of OMAP34x intended for catalog distribution channels. The OMAP36x

840-577: The A15s in less computationally intensive tasks to increase power efficiency, two PowerVR SGX544MP graphics cores and a dedicated TI 2D BitBlt graphics accelerator, a multi-pipe display sub-system and a signal processor. They respectively support 24 and 20 megapixel cameras for front and rear 3D HD video recording. The chip also supports up to 8 GB of dual channel LPDDR2/ DDR3 memory, output to four HD 3D displays and 3D HDMI 1.4 video output. OMAP 5 also includes three USB 2.0 ports, one lowspeed USB 3.0 OTG port and

882-675: The EU supported STMicroelectronics for the construction of a silicon carbide wafer plant in Catania with €293 million through the Recovery and Resilience Facility to be completed in 2026, and in line with the European Chips Act . STmicro eSIM and SIM production facility for embedded form factor eSIM. As of 2010, ST employed around 1,800 people in Kirkop , making it the largest private sector employer , and

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924-501: The OMAP 4430, OMAP 4460 (formerly named 4440), and OMAP 4470. The 4th generation OMAPs have a dual-core ARM Cortex-A9 CPU with two ARM Cortex-M3 cores, as part of the "Ducati" sub-system for off-loading low-level tasks. The OMAP 4430 was the SoC used in Google Glass . OMAP 4 uses ARM Cortex-A9's with ARM's SIMD engine (Media Processing Engine, aka NEON) which in some cases may have

966-458: The OMAP product line is from partnership with cell phone vendors, and the main distribution channel involves sales directly to such wireless handset vendors. Parts developed to suit evolving cell phone requirements are flexible and powerful enough to support sales through less specialized catalog channels; some OMAP 1 parts, and many OMAP 3 parts, have catalog versions with different sales and support models. Parts that are obsolete from

1008-594: The Viewsonic VSD220, which uses an OMAP 4430. OMAP SoCs are also used as the basis for a number of hobbyist, prototyping and evaluation boards, such as the BeagleBoard , PandaBoard , OMAP3 Board, Gumstix and Presonus digital mixing boards Motorola MOTOTRBO 2. generation radios use the OMAP-L132 or OMAP-L138 secure CPU. STMicroelectronics STMicroelectronics NV (commonly referred to as ST or STMicro )

1050-556: The company also listed on the Italian Bourse in Milan . In 2002, Motorola and TSMC joined ST and Philips in a new technology partnership. The Crolles 2 Alliance was created with a new 12" wafer manufacturing facility located in Crolles , France. In 2005, chief executive officer Pasquale Pistorio was succeeded by Carlo Bozotti, who then headed the memory products division and had been with

1092-533: The company’s predecessor since 1977. By 2005, ST was ranked fifth, behind Intel , Samsung , Texas Instruments and Toshiba , but ahead of Infineon , Renesas , NEC , NXP Semiconductors , and Freescale . The company was the largest European semiconductors supplier, ahead of Infineon and NXP. Early in 2007, NXP Semiconductors (formerly Philips Semiconductors) and Freescale (formerly Motorola Semiconductors) decided to stop their participation in Crolles 2 Alliance. Under

1134-535: The country's leading exporter . In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh . Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 200 mm (8 in) fab, this is now an important 200 mm (8 in) wafer fab of

1176-611: The facility and to work together on process development. The technologies developed at the facility were also used by global semiconductor foundry TSMC of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity. A new fab is under construction since 2015. Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards , microcontrollers , and EEPROM as well as several R&D centers. Rousset also hosts an 8-inch (200-mm) fab, which

1218-424: The group. Ang Mo Kio also hosts some design centers. As of 2004, the site employed 6,000 staff. Update-2012: Numonyx JV (with Intel) is acquired by Micron in 2010. As such, AMK8 Fab (200mm HVM Fab) is currently a Micron entity. AMK5 and AMK6 remains to be STM entities. Update-2019: AMK8 has been reacquired by STM from Micron. Application, design and support. about 110 employees. Divisions: MCD Founded in 1979 as

1260-576: The new company and NXP 20%. This joint venture began on August 20, 2008. On February 10, 2009, ST Ericsson , a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established. ST Ericsson was a multinational manufacturer of wireless products and semiconductors , supplying to mobile device manufacturers. ST-Ericsson was a 50/50 joint venture of STMicroelectronics and Ericsson established on February 3, 2009, and dissolved on August 2, 2013. Headquartered in Geneva , Switzerland, it

1302-435: The newer versions are highly integrated for use in very low cost cell phones. The OMAP L-1x parts are marketed only through catalog channels, and have a different technological heritage than the other OMAP parts. Rather than deriving directly from cell phone product lines, they grew from the video-oriented DaVinci product line by removing the video-specific features while using upgraded DaVinci peripherals. A notable feature

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1344-490: The perspective of handset vendors may still be needed to support products developed using catalog parts and distributor-based inventory management. These are parts originally intended for use as application processors in smartphones , with processors powerful enough to run significant operating systems (such as Linux , FreeBSD , Android or Symbian ), support connectivity to personal computers, and support various audio and video applications. The OMAP 1 family started with

1386-414: The production is scaled at 0.18 μm, 0.13 μm, 90 nm and 65 nm (measurements of transistor gate length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages. Major sites include: Grenoble is one of the company's most important R&D centres, employing around 4,000 staff. The Polygone site employs 2,200 staff and

1428-414: The terms of the agreement the Alliance came to an end on December 31, 2007. On May 22, 2007, ST and Intel created a joint venture in the memory application called Numonyx : this new company merged ST and Intel Flash Memory activities. Semiconductor market consolidation continued with ST and NXP announcing on April 10, 2008, the creation of a new joint venture of their mobile activities, with ST owning 80% of

1470-487: Was a fabless company , outsourcing semiconductor manufacturing to foundry companies. In 2011, ST announced the creation of a joint lab with Sant'Anna School of Advanced Studies . The lab focuses on research and innovation in biorobotics , smart systems and microelectronics. Past collaborations with Sant'Anna School of Advanced Studies included DustBot, a platform that integrated self-navigating "service robots" for waste collection. In 2018, chief executive Carlo Bozotti

1512-563: Was created in 1982 by the French government's widespread nationalization of industries following the election of socialist François Mitterrand to the presidency . It included: At the time of the merger of these two companies in 1987, the new corporation was named SGS-THOMSON and was led by chief executive officer Pasquale Pistorio. The company took its current name of STMicroelectronics in May 1998 following Thomson's sale of its shares. After its creation ST

1554-597: Was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using germanium . The site's two major wafer fabs are a 200 mm (8 in) fab, opened in April 1997 by then-Italian Prime Minister Romano Prodi , and a 300 mm (12 in) fab that has never been completed and which was transferred in its current state to "Numonyx" in 2008. A new manufacturing facility for silicon carbide ( SiC ) substrates of 150 mm should open here in 2023. In October 2022,

1596-758: Was named Nomadik .) OMAP enjoyed some success in the smartphone and tablet market until 2011 when it lost ground to Qualcomm Snapdragon . On September 26, 2012, Texas Instruments announced that they would wind down their operations in smartphone and tablet oriented chips and focus on embedded platforms instead. On November 14, 2012, Texas Instruments announced they would cut 1,700 jobs due to their shift from mobile to embedded platforms. The last OMAP5 chips were released in Q2 2013. The OMAP family consists of three product groups classified by performance and intended application: Further, two main distribution channels exist, and not all parts are available in both channels. The genesis of

1638-403: Was opened on May 15, 2000 by French prime minister Lionel Jospin . The site opened in 1979 as a 100 mm (3.9 in) fab operated by Eurotechnique, a joint venture between Saint-Gobain of France and National Semiconductor of the US. Rousset was sold to Thomson-CSF in 1982 as part of the French government's 1981–82 nationalization of several industries. As part of the nationalisation,

1680-671: Was opened on September 9, 1993 by Gérard Longuet, French minister for industry, and Alain Carignon, mayor of Grenoble. The 300 mm (12 in) fab was inaugurated by French president Jacques Chirac , on February 27, 2003. It includes an R&D center which focuses on developing new nanometric technology processes for 90-nm to 32-nm scale using 300 mm (12 in) wafers and it was developed for The Crolles 2 Alliance . This alliance of STMicroelectronics, TSMC , NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop

1722-450: Was ranked 14th among the top 20 semiconductor suppliers with sales of around US$ 850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including: On December 8, 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when

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1764-624: Was succeeded by Jean-Marc Chery. In 2023, STMicroelectronics partnered with Synopsys to design a working chip on Microsoft Corp’s cloud, marking the first time AI software had been utilized for chip design. In 2024, ST became the sixth shareholder of Quintauris , a joint company with the goal of standardizing RISC-V ecosystem. As of December 31, 2014, the shareholders were: Unlike fabless semiconductor companies , STMicroelectronics owns and operates its own semiconductor wafer fabs . The company owned five 5-inch (200 mm) wafer fabs and 1 12-inch (300 mm) wafer fab in 2006. Most of

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