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In electronics , the metal–oxide–semiconductor field-effect transistor ( MOSFET , MOS-FET , MOS FET , or MOS transistor ) is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon . It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals . The term metal–insulator–semiconductor field-effect transistor ( MISFET ) is almost synonymous with MOSFET . Another near-synonym is insulated-gate field-effect transistor ( IGFET ).

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111-659: MOS Technology, Inc. ("MOS" being short for Metal Oxide Semiconductor ), later known as CSG (Commodore Semiconductor Group) and GMT Microelectronics , was a semiconductor design and fabrication company based in Audubon, Pennsylvania . It is most famous for its 6502 microprocessor and various designs for Commodore International 's range of home computers . Three former General Instrument executives, John Paivinen, Mort Jaffe and Don McLaughlin, formed MOS Technology in Valley Forge, Pennsylvania in 1969. The Allen-Bradley Company

222-429: A depletion layer by forcing the positively charged holes away from the gate-insulator/semiconductor interface, leaving exposed a carrier-free region of immobile, negatively charged acceptor ions (see doping ). If V G is high enough, a high concentration of negative charge carriers forms in an inversion layer located in a thin layer next to the interface between the semiconductor and the insulator. Conventionally,

333-494: A pure-play semiconductor foundry , so they had to join a chip-building company to produce their new CPU. MOS was a small firm with good credentials in the right area, the east coast of the US. The team of four design engineers was headed by Chuck Peddle and included Bill Mensch . At MOS they set about building a new CPU that would outperform the 6800 while being similar to it in purpose and much less expensive. The resulting 6501 design

444-551: A MOSFET. In the case of a p-type MOSFET, bulk inversion happens when the intrinsic energy level at the surface becomes smaller than the Fermi level at the surface. This can be seen on a band diagram. The Fermi level defines the type of semiconductor in discussion. If the Fermi level is equal to the Intrinsic level, the semiconductor is of intrinsic, or pure type. If the Fermi level lies closer to

555-505: A basic ALU operation, such as "add", with the access of one or more operands in memory (using addressing modes such as direct, indirect, indexed, etc.). Certain architectures may allow two or three operands (including the result) directly in memory or may be able to perform functions such as automatic pointer increment, etc. Software-implemented instruction sets may have even more complex and powerful instructions. Reduced instruction-set computers , RISC , were first widely implemented during

666-535: A bipolar transistor. The subthreshold I–V curve depends exponentially upon threshold voltage, introducing a strong dependence on any manufacturing variation that affects threshold voltage; for example: variations in oxide thickness, junction depth, or body doping that change the degree of drain-induced barrier lowering. The resulting sensitivity to fabricational variations complicates optimization for leakage and performance. When V GS > V th and V DS < V GS  − V th : The transistor

777-404: A buried oxide is formed below a thin semiconductor layer. If the channel region between the gate dielectric and the buried oxide region is very thin, the channel is referred to as an ultrathin channel region with the source and drain regions formed on either side in or above the thin semiconductor layer. Other semiconductor materials may be employed. When the source and drain regions are formed above

888-401: A cache line or virtual memory page boundary, for instance), and are therefore somewhat easier to optimize for speed. In early 1960s computers, main memory was expensive and very limited, even on mainframes. Minimizing the size of a program to make sure it would fit in the limited memory was often central. Thus the size of the instructions needed to perform a particular task, the code density ,

999-428: A computer or a family of computers. A device or program that executes instructions described by that ISA, such as a central processing unit (CPU), is called an implementation of that ISA. In general, an ISA defines the supported instructions , data types , registers , the hardware support for managing main memory , fundamental features (such as the memory consistency , addressing modes , virtual memory ), and

1110-415: A conditional branch instruction will transfer control if the condition is true, so that execution proceeds to a different part of the program, and not transfer control if the condition is false, so that execution continues sequentially. Some instruction sets also have conditional moves, so that the move will be executed, and the data stored in the target location, if the condition is true, and not executed, and

1221-481: A few minor differences: an added on-chip clock oscillator, a different functional pinout arrangement, generation of the SYNC signal (supporting single-instruction stepping), and removal of data bus enablement control signals (DBE and BA, with the former directly connected to the phase 2 clock instead). It outperformed the more-complex 6800 and Intel 8080 , but cost much less and was easier to work with. Although it did not have

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1332-572: A given instruction may specify: More complex operations are built up by combining these simple instructions, which are executed sequentially, or as otherwise directed by control flow instructions. Examples of operations common to many instruction sets include: Processors may include "complex" instructions in their instruction set. A single "complex" instruction does something that may take many instructions on other computers. Such instructions are typified by instructions that take multiple steps, control multiple functional units, or otherwise appear on

1443-593: A larger scale than the bulk of simple instructions implemented by the given processor. Some examples of "complex" instructions include: Complex instructions are more common in CISC instruction sets than in RISC instruction sets, but RISC instruction sets may include them as well. RISC instruction sets generally do not include ALU operations with memory operands, or instructions to move large blocks of memory, but most RISC instruction sets include SIMD or vector instructions that perform

1554-476: A long-channel device, there is no drain voltage dependence of the current once V DS ≫ V T {\displaystyle V_{\text{DS}}\gg V_{\text{T}}} , but as channel length is reduced drain-induced barrier lowering introduces drain voltage dependence that depends in a complex way upon the device geometry (for example, the channel doping, the junction doping and so on). Frequently, threshold voltage V th for this mode

1665-419: A period of rapidly growing memory subsystems. They sacrifice code density to simplify implementation circuitry, and try to increase performance via higher clock frequencies and more registers. A single RISC instruction typically performs only a single operation, such as an "add" of registers or a "load" from a memory location into a register. A RISC instruction set normally has a fixed instruction length , whereas

1776-539: A single architecture for a series of five processors spanning a wide range of cost and performance. None of the five engineering design teams could count on being able to bring about adjustments in architectural specifications as a way of easing difficulties in achieving cost and performance objectives. Some virtual machines that support bytecode as their ISA such as Smalltalk , the Java virtual machine , and Microsoft 's Common Language Runtime , implement this by translating

1887-545: A single instruction. Some exotic instruction sets do not have an opcode field, such as transport triggered architectures (TTA), only operand(s). Most stack machines have " 0-operand " instruction sets in which arithmetic and logical operations lack any operand specifier fields; only instructions that push operands onto the evaluation stack or that pop operands from the stack into variables have operand specifiers. The instruction set carries out most ALU actions with postfix ( reverse Polish notation ) operations that work only on

1998-408: A standard and compatible application binary interface (ABI) for a particular ISA, machine code will run on future implementations of that ISA and operating system. However, if an ISA supports running multiple operating systems, it does not guarantee that machine code for one operating system will run on another operating system, unless the first operating system supports running machine code built for

2109-463: A typical CISC instruction set has instructions of widely varying length. However, as RISC computers normally require more and often longer instructions to implement a given task, they inherently make less optimal use of bus bandwidth and cache memories. Certain embedded RISC ISAs like Thumb and AVR32 typically exhibit very high density owing to a technique called code compression. This technique packs two 16-bit instructions into one 32-bit word, which

2220-529: A writable control store use it to allow the instruction set to be changed (for example, the Rekursiv processor and the Imsys Cjip ). CPUs designed for reconfigurable computing may use field-programmable gate arrays (FPGAs). An ISA can also be emulated in software by an interpreter . Naturally, due to the interpretation overhead, this is slower than directly running programs on the emulated hardware, unless

2331-415: Is 15 bytes (120 bits). Within an instruction set, different instructions may have different lengths. In some architectures, notably most reduced instruction set computers (RISC), instructions are a fixed length , typically corresponding with that architecture's word size . In other architectures, instructions have variable length , typically integral multiples of a byte or a halfword . Some, such as

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2442-444: Is a complex issue. There were two stages in history for the microprocessor. The first was the CISC (Complex Instruction Set Computer), which had many different instructions. In the 1970s, however, places like IBM did research and found that many instructions in the set could be eliminated. The result was the RISC (Reduced Instruction Set Computer), an architecture that uses a smaller set of instructions. A simpler instruction set may offer

2553-748: Is a weak-inversion current, sometimes called subthreshold leakage. In weak inversion where the source is tied to bulk, the current varies exponentially with V GS {\displaystyle V_{\text{GS}}} as given approximately by: I D ≈ I D0 e V GS − V th n V T , {\displaystyle I_{\text{D}}\approx I_{\text{D0}}e^{\frac {V_{\text{GS}}-V_{\text{th}}}{nV_{\text{T}}}},} where I D0 {\displaystyle I_{\text{D0}}} = current at V GS = V th {\displaystyle V_{\text{GS}}=V_{\text{th}}} ,

2664-709: Is defined as the gate voltage at which a selected value of current I D0 occurs, for example, I D0 = 1   μA, which may not be the same V th -value used in the equations for the following modes. Some micropower analog circuits are designed to take advantage of subthreshold conduction. By working in the weak-inversion region, the MOSFETs in these circuits deliver the highest possible transconductance-to-current ratio, namely: g m / I D = 1 / ( n V T ) {\displaystyle g_{m}/I_{\text{D}}=1/\left(nV_{\text{T}}\right)} , almost that of

2775-599: Is due to the many addressing modes and optimizations (such as sub-register addressing, memory operands in ALU instructions, absolute addressing, PC-relative addressing, and register-to-register spills) that CISC ISAs offer. The size or length of an instruction varies widely, from as little as four bits in some microcontrollers to many hundreds of bits in some VLIW systems. Processors used in personal computers , mainframes , and supercomputers have minimum instruction sizes between 8 and 64 bits. The longest possible instruction on x86

2886-415: Is equivalent to a planar capacitor , with one of the electrodes replaced by a semiconductor. When a voltage is applied across a MOS structure, it modifies the distribution of charges in the semiconductor. If we consider a p-type semiconductor (with N A the density of acceptors , p the density of holes; p = N A in neutral bulk), a positive voltage, V G , from gate to body (see figure) creates

2997-553: Is similar to the code density of RISC; the increased instruction density is offset by requiring more of the primitive instructions to do a task. There has been research into executable compression as a mechanism for improving code density. The mathematics of Kolmogorov complexity describes the challenges and limits of this. In practice, code density is also dependent on the compiler . Most optimizing compilers have options that control whether to optimize code generation for execution speed or for code density. For instance GCC has

3108-501: Is the charge-carrier effective mobility, W {\displaystyle W} is the gate width, L {\displaystyle L} is the gate length and C ox {\displaystyle C_{\text{ox}}} is the gate oxide capacitance per unit area. The transition from the exponential subthreshold region to the triode region is not as sharp as the equations suggest. When V GS > V th and V DS ≥ (V GS  – V th ): The switch

3219-432: Is then unpacked at the decode stage and executed as two instructions. Minimal instruction set computers (MISC) are commonly a form of stack machine , where there are few separate instructions (8–32), so that multiple instructions can be fit into a single machine word. These types of cores often take little silicon to implement, so they can be easily realized in an FPGA or in a multi-core form. The code density of MISC

3330-787: Is turned on, and a channel has been created which allows current between the drain and the source. The MOSFET operates like a resistor, controlled by the gate voltage relative to both the source and drain voltages. The current from drain to source is modeled as: I D = μ n C ox W L ( ( V GS − V t h ) V DS − V DS 2 2 ) {\displaystyle I_{\text{D}}=\mu _{n}C_{\text{ox}}{\frac {W}{L}}\left(\left(V_{\text{GS}}-V_{\rm {th}}\right)V_{\text{DS}}-{\frac {{V_{\text{DS}}}^{2}}{2}}\right)} where μ n {\displaystyle \mu _{n}}

3441-427: Is turned on, and a channel has been created, which allows current between the drain and source. Since the drain voltage is higher than the source voltage, the electrons spread out, and conduction is not through a narrow channel but through a broader, two- or three-dimensional current distribution extending away from the interface and deeper in the substrate. The onset of this region is also known as pinch-off to indicate

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3552-447: The 45 nanometer node. When a voltage is applied between the gate and the source, the electric field generated penetrates through the oxide and creates an inversion layer or channel at the semiconductor-insulator interface. The inversion layer provides a channel through which current can pass between source and drain terminals. Varying the voltage between the gate and body modulates the conductivity of this layer and thereby controls

3663-497: The ARM with Thumb-extension have mixed variable encoding, that is two fixed, usually 32-bit and 16-bit encodings, where instructions cannot be mixed freely but must be switched between on a branch (or exception boundary in ARMv8). Fixed-length instructions are less complicated to handle than variable-length instructions for several reasons (not having to check whether an instruction straddles

3774-411: The compiler responsible for instruction issue and scheduling. Architectures with even less complexity have been studied, such as the minimal instruction set computer (MISC) and one-instruction set computer (OISC). These are theoretically important types, but have not been commercialized. Machine language is built up from discrete statements or instructions . On the processing architecture,

3885-518: The input/output model of implementations of the ISA. An ISA specifies the behavior of machine code running on implementations of that ISA in a fashion that does not depend on the characteristics of that implementation, providing binary compatibility between implementations. This enables multiple implementations of an ISA that differ in characteristics such as performance , physical size, and monetary cost (among other things), but that are capable of running

3996-529: The microarchitecture of a processor, engineers use blocks of "hard-wired" electronic circuitry (often designed separately) such as adders, multiplexers, counters, registers, ALUs, etc. Some kind of register transfer language is then often used to describe the decoding and sequencing of each instruction of an ISA using this physical microarchitecture. There are two basic ways to build a control unit to implement this description (although many designs use middle ways or compromises): Some microcoded CPU designs with

4107-543: The semiconductor of choice is silicon . Some chip manufacturers, most notably IBM and Intel , use an alloy of silicon and germanium ( SiGe ) in MOSFET channels. Many semiconductors with better electrical properties than silicon, such as gallium arsenide , do not form good semiconductor-to-insulator interfaces, and thus are not suitable for MOSFETs. Research continues on creating insulators with acceptable electrical characteristics on other semiconductor materials. To overcome

4218-457: The stack or in an implicit register. If some of the operands are given implicitly, fewer operands need be specified in the instruction. When a "destination operand" explicitly specifies the destination, an additional operand must be supplied. Consequently, the number of operands encoded in an instruction may differ from the mathematically necessary number of arguments for a logical or arithmetic operation (the arity ). Operands are either encoded in

4329-504: The x86 instruction set , but they have radically different internal designs. The concept of an architecture , distinct from the design of a specific machine, was developed by Fred Brooks at IBM during the design phase of System/360 . Prior to NPL [System/360], the company's computer designers had been free to honor cost objectives not only by selecting technologies but also by fashioning functional and architectural refinements. The SPREAD compatibility objective, in contrast, postulated

4440-431: The "opcode" representation of the instruction, or else are given as values or addresses following the opcode. Register pressure measures the availability of free registers at any point in time during the program execution. Register pressure is high when a large number of the available registers are in use; thus, the higher the register pressure, the more often the register contents must be spilled into memory. Increasing

4551-453: The 6501's advantage of being able to be used in place of the Motorola 6800 in existing hardware, it was so inexpensive that it quickly became more popular than the 6800, making that a moot point. The 6502 was so cheap that many people believed it was a scam when MOS first showed it at a 1975 trade show. They were not aware of MOS's masking techniques and when they calculated the price per chip at

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4662-447: The 6502 chip. At Commodore, Peddle convinced the owner, Jack Tramiel , that calculators were a dead end, and that home computers would soon be huge. However, the original design group appeared to be even less interested in working for Jack Tramiel than it had for Motorola, and the team quickly started breaking up. One result was that the newly completed 6522 (VIA) chip was left undocumented for years. Bill Mensch left MOS even before

4773-586: The 6502 was, the company itself was having problems. At about the same time the 6502 was being released, MOS's entire calculator IC market collapsed, and its prior existing products stopped shipping. Soon they were in serious financial trouble. Another company, Commodore Business Machines (CBM), had invested heavily in the calculator market and was also nearly wiped out by TI 's entry into the market. A fresh injection of capital saved CBM, and allowed it to invest in company suppliers in order to help ensure their IC supply would not be upset in this fashion again. Among

4884-459: The 6502—were achieving a success rate of 70 percent or better. This meant that not only were its designs faster, but they also cost much less as well. When the 6501 was announced, Motorola launched a lawsuit almost immediately. Although the 6501 instruction set was not compatible with the 6800, it could nevertheless be plugged into existing motherboard designs because it had the same functional pin arrangement and IC package footprint. That

4995-464: The 650x line from MOS, including Rockwell International , GTE , Synertek , and Western Design Center (WDC) . A number of different versions of the basic CPU, known as the 6503 through 6507, were offered in 28-pin packages for lower cost. The various models removed signal or address pins. Far and away the most popular of these was the 6507 , which was used in the Atari 2600 and Atari disk drives. The 6504

5106-529: The Commodore Semiconductor Group superfund site. Most of the MOS chips are named according to following rules, which shows used technology (logic gate design): 40°07′27.9″N 75°25′07.2″W  /  40.124417°N 75.418667°W  / 40.124417; -75.418667 Metal Oxide Semiconductor The main advantage of a MOSFET is that it requires almost no input current to control

5217-515: The Commodore takeover, and moved home to Arizona. After a short stint consulting for a local company called ICE, he set up the Western Design Center (WDC) in 1978. As a licensee of the 6502 line, their first products were bug-fixed, power-efficient CMOS versions of the 6502 (the 65C02 , both as a separate chip and embedded inside a microcontroller called the 65C150). But then they expanded

5328-432: The Fermi level and when the voltage reaches the threshold voltage, the intrinsic level does cross the Fermi level, and that is what is known as inversion. At that point, the surface of the semiconductor is inverted from p-type into n-type. If the Fermi level lies above the intrinsic level, the semiconductor is of n-type, therefore at inversion, when the intrinsic level reaches and crosses the Fermi level (which lies closer to

5439-405: The ability to "fix" its masks after they had been produced. This meant that as flaws in the design were discovered, the masks could be removed from the aligners, fixed, and put back in. This allowed them to rapidly drive out flaws in the original masks. The company's production lines typically reversed the numbers others were achieving; even the early runs of a new CPU design—what would become

5550-410: The addition of n-type source and drain regions. The MOS capacitor structure is the heart of the MOSFET. Consider a MOS capacitor where the silicon base is of p-type. If a positive voltage is applied at the gate, holes which are at the surface of the p-type substrate will be repelled by the electric field generated by the voltage applied. At first, the holes will simply be repelled and what will remain on

5661-455: The aftermath; those that survived did so by finding other chips to produce. MOS became a supplier to Atari , producing a custom single-chip Pong system. Things changed dramatically in 1975. Several of the designers of the Motorola 6800 left Motorola shortly after its release, after management told them to stop working on a low-cost version of the design. At the time there was no such thing as

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5772-423: The aligners by the truckload. This meant that if a flaw was found in the design, it would cost a significant amount of money to fix it, as all the older masks would have to be thrown out. In contrast, with Micralign there was only one mask per aligner, so there was no inherent cost in replacing the mask if need be, although the cost, and especially time, of producing these master masks was considerable. MOS developed

5883-448: The body) are highly doped as signified by a "+" sign after the type of doping. If the MOSFET is an n-channel or nMOS FET, then the source and drain are n+ regions and the body is a p region. If the MOSFET is a p-channel or pMOS FET, then the source and drain are p+ regions and the body is a n region. The source is so named because it is the source of the charge carriers (electrons for n-channel, holes for p-channel) that flow through

5994-595: The bytecode for commonly used code paths into native machine code. In addition, these virtual machines execute less frequently used code paths by interpretation (see: Just-in-time compilation ). Transmeta implemented the x86 instruction set atop VLIW processors in this fashion. An ISA may be classified in a number of different ways. A common classification is by architectural complexity . A complex instruction set computer (CISC) has many specialized instructions, some of which may only be rarely used in practical programs. A reduced instruction set computer (RISC) simplifies

6105-406: The channel in whole or in part, they are referred to as raised source/drain regions. The operation of a MOSFET can be separated into three different modes, depending on the voltages at the terminals. In the following discussion, a simplified algebraic model is used. Modern MOSFET characteristics are more complex than the algebraic model presented here. For an enhancement-mode, n-channel MOSFET ,

6216-493: The channel-length modulation parameter, models current dependence on drain voltage due to the Early effect , or channel length modulation . According to this equation, a key design parameter, the MOSFET transconductance is: Instruction set In computer science , an instruction set architecture ( ISA ) is an abstract model that generally defines how software controls the CPU in

6327-408: The channel; similarly, the drain is where the charge carriers leave the channel. The occupancy of the energy bands in a semiconductor is set by the position of the Fermi level relative to the semiconductor energy-band edges. With sufficient gate voltage, the valence band edge is driven far from the Fermi level, and holes from the body are driven away from the gate. At larger gate bias still, near

6438-458: The company, operating under the name GMT Microelectronics ( G reat M ixed-signal T echnologies ), reopened MOS Technology's original, circa-1970 one-micrometre process fab ( semiconductor fabrication plant ) in Audubon , Montgomery County , Pennsylvania that Commodore had closed in 1993. The plant had been on the EPA's National Priorities List of hazardous waste sites since October 4, 1989. This

6549-414: The conduction band (valence band) then the semiconductor type will be of n-type (p-type). When the gate voltage is increased in a positive sense (for the given example), this will shift the intrinsic energy level band so that it will curve downwards towards the valence band. If the Fermi level lies closer to the valence band (for p-type), there will be a point when the Intrinsic level will start to cross

6660-422: The current flow between drain and source. This is known as enhancement mode. The traditional metal–oxide–semiconductor (MOS) structure is obtained by growing a layer of silicon dioxide ( SiO 2 ) on top of a silicon substrate, commonly by thermal oxidation and depositing a layer of metal or polycrystalline silicon (the latter is commonly used). As silicon dioxide is a dielectric material, its structure

6771-432: The current industry yield rates, it did not add up. But any hesitation to buy it evaporated when both Motorola and Intel dropped the prices on their own designs from $ 179 to $ 69 at the same show in order to compete. Their moves legitimized the 6502, and by the show's end, the wooden barrel full of samples was empty. The 6502 would quickly go on to be one of the most popular chips of its day. A number of companies licensed

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6882-731: The depletion layer and C ox {\displaystyle C_{\text{ox}}} = capacitance of the oxide layer. This equation is generally used, but is only an adequate approximation for the source tied to the bulk. For the source not tied to the bulk, the subthreshold equation for drain current in saturation is I D ≈ I D0 e V G − V th n V T e − V S V T . {\displaystyle I_{\text{D}}\approx I_{\text{D0}}e^{\frac {V_{\text{G}}-V_{\text{th}}}{nV_{\text{T}}}}e^{-{\frac {V_{\text{S}}}{V_{\text{T}}}}}.} In

6993-418: The device may be referred to as a metal-insulator-semiconductor FET (MISFET). Compared to the MOS capacitor, the MOSFET includes two additional terminals ( source and drain ), each connected to individual highly doped regions that are separated by the body region. These regions can be either p or n type, but they must both be of the same type, and of opposite type to the body region. The source and drain (unlike

7104-469: The diffusion processes, and H. K. Gummel and R. Lindner who characterized the device. This was a culmination of decades of field-effect research that began with Lilienfeld. The first MOS transistor at Bell Labs was about 100 times slower than contemporary bipolar transistors and was initially seen as inferior. Nevertheless, Kahng pointed out several advantages of the device, notably ease of fabrication and its application in integrated circuits . Usually

7215-468: The effect of thermal energy on the Fermi–Dirac distribution of electron energies which allow some of the more energetic electrons at the source to enter the channel and flow to the drain. This results in a subthreshold current that is an exponential function of gate-source voltage. While the current between drain and source should ideally be zero when the transistor is being used as a turned-off switch, there

7326-424: The electron is now fixed onto the atom and immobile. As the voltage at the gate increases, there will be a point at which the surface above the depletion region will be converted from p-type into n-type, as electrons from the bulk area will start to get attracted by the larger electric field. This is known as inversion . The threshold voltage at which this conversion happens is one of the most important parameters in

7437-406: The expression stack , not on data registers or arbitrary main memory cells. This can be very convenient for compiling high-level languages, because most arithmetic expressions can be easily translated into postfix notation. Conditional instructions often have a predicate field—a few bits that encode the specific condition to cause an operation to be performed rather than not performed. For example,

7548-549: The firm basically became Commodore's production arm, they continued using the name MOS for some time so that manuals would not have to be reprinted. After a while MOS became the Commodore Semiconductor Group (CSG) . Despite being renamed to CSG, all chips produced were still stamped with the old "MOS" logo until week 22/23 of 1989. MOS had previously designed a simple computer kit called the KIM-1 , primarily to "show off"

7659-481: The form of CMOS logic . The basic principle of the field-effect transistor was first patented by Julius Edgar Lilienfeld in 1925. In 1934, inventor Oskar Heil independently patented a similar device in Europe. In the 1940s, Bell Labs scientists William Shockley , John Bardeen and Walter Houser Brattain attempted to build a field-effect device, which led to their discovery of the transistor effect. However,

7770-413: The gate leads to a higher electron density in the inversion layer and therefore increases the current flow between the source and drain. For gate voltages below the threshold value, the channel is lightly populated, and only a very small subthreshold leakage current can flow between the source and the drain. When a negative gate-source voltage (positive source-gate) is applied, it creates a p-channel at

7881-408: The gate voltage at which the volume density of electrons in the inversion layer is the same as the volume density of holes in the body is called the threshold voltage . When the voltage between transistor gate and source ( V G ) exceeds the threshold voltage ( V th ), the difference is known as overdrive voltage . This structure with p-type body is the basis of the n-type MOSFET, which requires

7992-414: The hardware running the emulator is an order of magnitude faster. Today, it is common practice for vendors of new ISAs or microarchitectures to make software emulators available to software developers before the hardware implementation is ready. Often the details of the implementation have a strong influence on the particular instructions selected for the instruction set. For example, many implementations of

8103-417: The increase in power consumption due to gate current leakage, a high-κ dielectric is used instead of silicon dioxide for the gate insulator, while polysilicon is replaced by metal gates (e.g. Intel , 2009). The gate is separated from the channel by a thin insulating layer, traditionally of silicon dioxide and later of silicon oxynitride . Some companies use a high-κ dielectric and metal gate combination in

8214-546: The instruction set includes support for something such as " fetch-and-add ", " load-link/store-conditional " (LL/SC), or "atomic compare-and-swap ". A given instruction set can be implemented in a variety of ways. All ways of implementing a particular instruction set provide the same programming model , and all implementations of that instruction set are able to run the same executables. The various ways of implementing an instruction set give different tradeoffs between cost, performance, power consumption, size, etc. When designing

8325-818: The lack of channel region near the drain. Although the channel does not extend the full length of the device, the electric field between the drain and the channel is very high, and conduction continues. The drain current is now weakly dependent upon drain voltage and controlled primarily by the gate-source voltage, and modeled approximately as: I D = μ n C ox 2 W L [ V GS − V th ] 2 [ 1 + λ V DS ] . {\displaystyle I_{\text{D}}={\frac {\mu _{n}C_{\text{ox}}}{2}}{\frac {W}{L}}\left[V_{\text{GS}}-V_{\text{th}}\right]^{2}\left[1+\lambda V_{\text{DS}}\right].} The additional factor involving λ,

8436-658: The large number of bits needed to encode the three registers of a 3-operand instruction, RISC architectures that have 16-bit instructions are invariably 2-operand designs, such as the Atmel AVR, TI MSP430 , and some versions of ARM Thumb . RISC architectures that have 32-bit instructions are usually 3-operand designs, such as the ARM , AVR32 , MIPS , Power ISA , and SPARC architectures. Each instruction specifies some number of operands (registers, memory locations, or immediate values) explicitly . Some instructions give one or both operands implicitly, such as by being stored on top of

8547-458: The line greatly with the introduction of the 65816 , a fairly straightforward 16-bit upgrade of the original 65C02 that could also run in 8-bit mode for compatibility. Since then WDC moved much of the original MOS catalog to CMOS, and the 6502 continued to be a popular CPU for the embedded systems market, like medical equipment and car dashboard controllers. After Commodore's bankruptcy in 1994, Commodore Semiconductor Group, MOS's successor,

8658-440: The load current, when compared to bipolar junction transistors (BJTs). In an enhancement mode MOSFET, voltage applied to the gate terminal increases the conductivity of the device. In depletion mode transistors, voltage applied at the gate reduces the conductivity. The "metal" in the name MOSFET is sometimes a misnomer , because the gate material can be a layer of polysilicon (polycrystalline silicon). Similarly, "oxide" in

8769-437: The mechanism of thermally grown oxides and fabricated a high quality Si/ SiO 2 stack in 1960. Following this research, Mohamed Atalla and Dawon Kahng proposed a silicon MOS transistor in 1959 and successfully demonstrated a working MOS device with their Bell Labs team in 1960. Their team included E. E. LaBate and E. I. Povilonis who fabricated the device; M. O. Thurston, L. A. D’Asaro, and J. R. Ligenza who developed

8880-530: The most fundamental abstractions in computing . An instruction set architecture is distinguished from a microarchitecture , which is the set of processor design techniques used, in a particular processor, to implement the instruction set. Processors with different microarchitectures can share a common instruction set. For example, the Intel Pentium and the AMD Athlon implement nearly identical versions of

8991-470: The name can also be a misnomer, as different dielectric materials are used with the aim of obtaining strong channels with smaller applied voltages. The MOSFET is by far the most common transistor in digital circuits, as billions may be included in a memory chip or microprocessor. Since MOSFETs can be made with either p-type or n-type semiconductors, complementary pairs of MOS transistors can be used to make switching circuits with very low power consumption, in

9102-401: The number of registers in an architecture decreases register pressure but increases the cost. While embedded instruction sets such as Thumb suffer from extremely high register pressure because they have small register sets, general-purpose RISC ISAs like MIPS and Alpha enjoy low register pressure. CISC ISAs like x86-64 offer low register pressure despite having smaller register sets. This

9213-439: The operation to perform, such as add contents of memory to register —and zero or more operand specifiers, which may specify registers , memory locations, or literal data. The operand specifiers may have addressing modes determining their meaning or may be in fixed fields. In very long instruction word (VLIW) architectures, which include many microcode architectures, multiple simultaneous opcodes and operands are specified in

9324-447: The option -Os to optimize for small machine code size, and -O3 to optimize for execution speed at the cost of larger machine code. The instructions constituting a program are rarely specified using their internal, numeric form ( machine code ); they may be specified by programmers using an assembly language or, more commonly, may be generated from high-level programming languages by compilers . The design of instruction sets

9435-451: The other operating system. An ISA can be extended by adding instructions or other capabilities, or adding support for larger addresses and data values; an implementation of the extended ISA will still be able to execute machine code for versions of the ISA without those extensions. Machine code using those extensions will only run on implementations that support those extensions. The binary compatibility that they provide makes ISAs one of

9546-476: The potential for higher speeds, reduced processor size, and reduced power consumption. However, a more complex set may optimize common operations, improve memory and cache efficiency, or simplify programming. Some instruction set designers reserve one or more opcodes for some kind of system call or software interrupt . For example, MOS Technology 6502 uses 00 H , Zilog Z80 uses the eight codes C7,CF,D7,DF,E7,EF,F7,FF H while Motorola 68000 use codes in

9657-570: The processor by efficiently implementing only the instructions that are frequently used in programs, while the less common operations are implemented as subroutines, having their resulting additional processor execution time offset by infrequent use. Other types include very long instruction word (VLIW) architectures, and the closely related long instruction word (LIW) and explicitly parallel instruction computing (EPIC) architectures. These architectures seek to exploit instruction-level parallelism with less hardware than RISC and CISC by making

9768-475: The range A000..AFFF H . Fast virtual machines are much easier to implement if an instruction set meets the Popek and Goldberg virtualization requirements . The NOP slide used in immunity-aware programming is much easier to implement if the "unprogrammed" state of the memory is interpreted as a NOP . On systems with multiple processors, non-blocking synchronization algorithms are much easier to implement if

9879-488: The same arithmetic operation on multiple pieces of data at the same time. SIMD instructions have the ability of manipulating large vectors and matrices in minimal time. SIMD instructions allow easy parallelization of algorithms commonly involved in sound, image, and video processing. Various SIMD implementations have been brought to market under trade names such as MMX , 3DNow! , and AltiVec . On traditional architectures, an instruction includes an opcode that specifies

9990-433: The same machine code, so that a lower-performance, lower-cost machine can be replaced with a higher-cost, higher-performance machine without having to replace software. It also enables the evolution of the microarchitectures of the implementations of that ISA, so that a newer, higher-performance implementation of an ISA can run software that runs on previous generations of implementations. If an operating system maintains

10101-463: The same surface. They showed that silicon dioxide insulated, protected silicon wafers and prevented dopants from diffusing into the wafer. Results of their work circulated around Bell Labs in the form of BTL memos before being published in 1957. At Shockley Semiconductor , Shockley had circulated the preprint of their article in December 1956 to his senior staff. J.R. Ligenza and W.G. Spitzer studied

10212-399: The semiconductor surface the conduction band edge is brought close to the Fermi level, populating the surface with electrons in an inversion layer or n-channel at the interface between the p region and the oxide. This conducting channel extends between the source and the drain, and current is conducted through it when a voltage is applied between the two electrodes. Increasing the voltage on

10323-570: The several companies were LED display manufacturers, power controllers, and suppliers of the driver chips, including MOS. In late 1976, CBM, publicly traded on the NYSE with a market capitalization around US$ 60 million , purchased MOS (whose market cap was around US$ 12 million ) in an all-stock deal. Holders of MOS received a 9.4 percent equity stake in CBM on the condition that Chuck Peddle would join Commodore as chief engineer. The deal went through, and while

10434-595: The site. Announced in March 1999, GMT would have provided foundry services based on TelCom's Bipolar and SiCr (silicon chromium) Thin Film Resistor processes and would have been a licensed alternate source for TelCom's Bipolar based products, with production running at 10,000 5-inch semiconductor wafers per month, producing CMOS , BiCMOS, NMOS, bipolar and SOI ( silicon on insulator ) devices. In 2000, GMT Microelectronics discontinued operations and abandoned all of its assets at

10545-567: The structure failed to show the anticipated effects, due to the problem of surface states : traps on the semiconductor surface that hold electrons immobile. With no surface passivation , they were only able to build the BJT and thyristor transistors. In 1955, Carl Frosch and Lincoln Derick accidentally grew a layer of silicon dioxide over the silicon wafer. By 1957, Frosch and Derick, using masking and predeposition, were able to manufacture planar transistors, in which drain and source were adjacent at

10656-418: The surface of the n region, analogous to the n-channel case, but with opposite polarities of charges and voltages. When a voltage less negative than the threshold value (a negative voltage for the p-channel) is applied between gate and source, the channel disappears and only a very small subthreshold current can flow between the source and the drain. The device may comprise a silicon on insulator device in which

10767-410: The surface will be immobile (negative) atoms of the acceptor type, which creates a depletion region on the surface. A hole is created by an acceptor atom, e.g., boron, which has one less electron than a silicon atom. Holes are not actually repelled, being non-entities; electrons are attracted by the positive field, and fill these holes. This creates a depletion region where no charge carriers exist because

10878-524: The target location not modified, if the condition is false. Similarly, IBM z/Architecture has a conditional store instruction. A few instruction sets include a predicate field in every instruction; this is called branch predication . Instruction sets may be categorized by the maximum number of operands explicitly specified in instructions. (In the examples that follow, a , b , and c are (direct or calculated) addresses referring to memory cells, while reg1 and so on refer to machine registers.) Due to

10989-417: The thermal voltage V T = k T / q {\displaystyle V_{\text{T}}=kT/q} and the slope factor n is given by: n = 1 + C dep C ox , {\displaystyle n=1+{\frac {C_{\text{dep}}}{C_{\text{ox}}}},} with C dep {\displaystyle C_{\text{dep}}} = capacitance of

11100-443: The three operational modes are: When V GS < V th : where V GS {\displaystyle V_{\text{GS}}} is gate-to-source bias and V th {\displaystyle V_{\text{th}}} is the threshold voltage of the device. According to the basic threshold model, the transistor is turned off, and there is no conduction between drain and source. A more accurate model considers

11211-421: The valence band), the semiconductor type changes at the surface as dictated by the relative positions of the Fermi and Intrinsic energy levels. A MOSFET is based on the modulation of charge concentration by a MOS capacitance between a body electrode and a gate electrode located above the body and insulated from all other device regions by a gate dielectric layer. If dielectrics other than an oxide are employed,

11322-451: Was a similar inversion in pricing. The 6800 sold in small lots for $ 295 ; with no other changes than using a Micralign , the same design could sell for $ 42 . The change to the Micralign revealed a further advantage. Previously the masks were mass-produced by photography companies like Kodak , who would make tens of thousands of copies of a master mask, or " reticle ", and ship the masks to

11433-749: Was an important characteristic of any instruction set. It remained important on the initially-tiny memories of minicomputers and then microprocessors. Density remains important today, for smartphone applications, applications downloaded into browsers over slow Internet connections, and in ROMs for embedded applications. A more general advantage of increased density is improved effectiveness of caches and instruction prefetch. Computers with high code density often have complex instructions for procedure entry, parameterized returns, loops, etc. (therefore retroactively named Complex Instruction Set Computers , CISC ). However, more typical, or frequent, "CISC" instructions merely combine

11544-417: Was bought by its former management for about $ 4.3 million , plus an additional $ 1 million to cover miscellaneous expenses including a United States Environmental Protection Agency (EPA) license. Dennis Peasenell became CEO. In December 1994, the EPA entered into a Prospective Purchase Agreement (limiting the company's liability in exchange for sharing the costs of cleanup) with GMT Microelectronics. In 1994,

11655-468: Was complete. In 1974 Perkin-Elmer publicly introduced the Micralign system, the first projection scanner. Instead of placing the mask on the surface of the chip, it held it far from the surface and used highly accurate optics to project the image. Masks now lasted for thousands of copies instead of tens, and the flaw rate of the chips inverted so that perhaps 70% of the chips produced would work. The result

11766-409: Was due to a 1978 leak of trichloroethylene (TCE) from an underground 250-gallon concrete storage tank used by Commodore Business Machines in the semiconductor cleaning process. Leaks from the tank had caused the local groundwater to become contaminated with TCE and other volatile organic compounds (VOCs) in 1978. By 1999 GMT Microelectronics had $ 21 million in revenues and 183 employees working on

11877-470: Was enough to allow Motorola to sue. Allen-Bradley sold back its shares to the founders, sales of the 6501 basically stopped, and the lawsuit would drag on for many years before MOS was eventually forced to pay US$ 200,000 in fines. In the meantime MOS had started selling the 6502 , a chip capable of operating at 1  MHz in September 1975 for a mere US$ 25 . It was nearly identical to the 6501, with only

11988-542: Was looking to provide a second source for electronic calculators and their chips designed by Texas Instruments (TI). In 1970 Allen-Bradley acquired a majority interest in MOS Technology. In the early 1970s, TI decided to release their own line of calculators, instead of selling just the chips inside them, and introduced them at a price that was lower than the price of the chipset alone. Many early chip companies were reliant on sales of calculator chips and were wiped out in

12099-413: Was placed directly on the surface of the chip, which had the significant disadvantage that it sometimes pulled away materials from the chip, which were then copied to subsequent chips. This caused the mask to become useless after about a dozen copies, and resulted in the vast majority of chips having fatal flaws; for a complex chip like the 6800, only about 10% of the chips would work once the masking process

12210-468: Was sometimes used in printers. MOS also released a series of similar CPUs using external clocks, which added a "1" to the name in the third digit, as the 6512 through 6515. These were useful in systems where the clock support was already being provided on the motherboard by some other source. The final addition was the "crossover" 6510 , used in the Commodore 64 , with additional I/O ports. However successful

12321-407: Was somewhat similar to the 6800, but by using several design simplifications, the 6501 would be up to four times faster. Previous CPU designs, like the 6800, were produced using a device known as a contact aligner . This was essentially a complex photocopier , which optically reproduced a CPU design, or "mask", on the surface of the silicon chip. The name "contact" referred to the fact that the mask

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