The HP 2100 is a series of 16-bit minicomputers that were produced by Hewlett-Packard (HP) from the mid-1960s to early 1990s. Tens of thousands of machines in the series were sold over its twenty-five year lifetime, making HP the fourth largest minicomputer vendor during the 1970s.
154-518: The design started at Data Systems Inc (DSI), and was originally known as the DSI-1000. HP purchased the company in 1964 and merged it into their Dymec division. The original model, the 2116A built using integrated circuits and magnetic-core memory , was released in 1966. Over the next four years, models A through C were released with different types of memory and expansion, as well as the cost-reduced 2115 and 2114 models. All of these models were replaced by
308-492: A design flow that engineers use to design, verify, and analyze entire semiconductor chips. Some of the latest EDA tools use artificial intelligence (AI) to help engineers save time and improve chip performance. Integrated circuits can be broadly classified into analog , digital and mixed signal , consisting of analog and digital signaling on the same IC. Digital integrated circuits can contain billions of logic gates , flip-flops , multiplexers , and other circuits in
462-627: A fabrication facility (commonly known as a semiconductor fab ) can cost over US$ 12 billion to construct. The cost of a fabrication facility rises over time because of increased complexity of new products; this is known as Rock's law . Such a facility features: ICs can be manufactured either in-house by integrated device manufacturers (IDMs) or using the foundry model . IDMs are vertically integrated companies (like Intel and Samsung ) that design, manufacture and sell their own ICs, and may offer design and/or manufacturing (foundry) services to other companies (the latter often to fabless companies ). In
616-553: A jump instruction . There is no stack for subroutines; instead, the first memory location of the routine is reserved, and the return address written to that location by the JSB instruction. This means there is no internal support for re-entrant code; support for this has to be added via a user-implemented stack. There are three basic styles of instructions in the ISA; memory references, register references, and input/output. Certain models extended
770-509: A microchip , computer chip , or simply chip , is a small electronic device made up of multiple interconnected electronic components such as transistors , resistors , and capacitors . These components are etched onto a small piece of semiconductor material, usually silicon . Integrated circuits are used in a wide range of electronic devices, including computers , smartphones , and televisions , to perform various functions such as processing and storing information. They have greatly impacted
924-412: A microprocessor will have memory on the chip. (See the regular array structure at the bottom of the first image. ) Although the structures are intricate – with widths which have been shrinking for decades – the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to "expose"
1078-425: A platinum resistance thermometer, so these two will disagree slightly at around 50 °C. There may be other causes due to imperfections in the instrument, e.g. in a liquid-in-glass thermometer if the capillary tube varies in diameter. For many purposes reproducibility is important. That is, does the same thermometer give the same reading for the same temperature (or do replacement or multiple thermometers give
1232-753: A switched-mode power supply allowed the chassis to be significantly smaller than the earlier models. By 1972, HP had shipped 4,500 minis, making it one of the largest companies in the market. That year, they merged the Mountain View Division, which made magnetic tape drives, with the Cupertino Division to create the Data Systems Division (DSD). By this time, the HP 3000 project was in serious trouble, and in February 1973, Packard sent Paul Ely to take over
1386-559: A temperature scale which now (slightly adjusted) bears his name . In 1742, Anders Celsius (1701–1744) proposed a scale with zero at the boiling point and 100 degrees at the freezing point of water, though the scale which now bears his name has them the other way around. French entomologist René Antoine Ferchault de Réaumur invented an alcohol thermometer and, temperature scale in 1730, that ultimately proved to be less reliable than Fahrenheit's mercury thermometer. The first physician to use thermometer measurements in clinical practice
1540-562: A 0 in bit 15. In addition to the Direct/Indirect mode, bit 10 of the instruction controls the Z/C flag. When set to 0, this means the address's upper five bits were zero while the lower 10 were the value in the instruction. This allows fast access to the Z(ero) page, the first 1,024 words of memory. When set to 1, the address is constructed by combining the 10 bits in the instruction to the top 5 bits of
1694-618: A 2114-like form factor. At the time they made this decision, 4kbit SRAMs were not actually available, so experimental machines using the core from a 2100 series were used initially, replaced by 1kbit SRAM. At first it appeared 4k parts would not be available by the time the rest of the machine had been upgraded, so the company canvassed various manufacturers and found that a few were aggressively developing 4k parts. In particular, Intel , Mostek , Motorola , and Texas Instruments were all suggesting such parts would be available in quantity by late 1974. Using such memories in an expansion chassis like
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#17328523742911848-1074: A building purchased from Varian Associates , becoming the Cupertino Division. Led by Magleby, the new division completed the design as the 2116A, which was demonstrated 7–10 November 1966 at the Joint Computer Conference in San Francisco. It was one of the earliest 16-bit minis to hit the market, but at the time it was more notable as "an unusual new instrumentation computer" with a highly expandable design and real-time support. The system featured an oversized cabinet that held up to 16 expansion cards, or could be further expanded to 48 cards with an external expansion cage. The system launched with 20 different instrumentation cards, including "counters, nuclear scalers, electronic thermometers , digital voltmeters , ac/ohms converters, data amplifiers, and input scanners." An additional set added input/output devices like tape drives , printers, punched cards , and paper tape , and other peripherals. Real-time service
2002-414: A closed system, the final state of the system is never colder than the initial state; except for phase changes with latent heat, it is hotter than the initial state. There are several principles on which empirical thermometers are built, as listed in the section of this article entitled "Primary and secondary thermometers". Several such principles are essentially based on the constitutive relation between
2156-466: A common active area, but there was no electrical isolation to separate them from each other. The monolithic integrated circuit chip was enabled by the inventions of the planar process by Jean Hoerni and p–n junction isolation by Kurt Lehovec . Hoerni's invention was built on Carl Frosch and Lincoln Derick's work on surface protection and passivation by silicon dioxide masking and predeposition, as well as Fuller, Ditzenberger's and others work on
2310-542: A common substrate in a three-stage amplifier arrangement. Jacobi disclosed small and cheap hearing aids as typical industrial applications of his patent. An immediate commercial use of his patent has not been reported. Another early proponent of the concept was Geoffrey Dummer (1909–2002), a radar scientist working for the Royal Radar Establishment of the British Ministry of Defence . Dummer presented
2464-581: A computer company, HP Labs manager Barney Oliver replied, "We didn't demand an answer to that question." Bill Hewlett initially refused to consider the development of a "minicomputer", but when Packard reframed it as an "instrument controller" the deal was approved. DSI was purchased in 1964 and initially set up at Dymec with four of the original five employees of DSI and a number of other employees coming from HP's instrumentation divisions. The computer group later moved to its own offices in Cupertino, California , in
2618-447: A constant volume air thermometer. Constant volume thermometers do not provide a way to avoid the problem of anomalous behaviour like that of water at approximately 4 °C. Planck's law very accurately quantitatively describes the power spectral density of electromagnetic radiation, inside a rigid walled cavity in a body made of material that is completely opaque and poorly reflective, when it has reached thermodynamic equilibrium, as
2772-534: A coordinate manifold of material behaviour. The points L {\displaystyle L} of the manifold M {\displaystyle M} are called 'hotness levels', and M {\displaystyle M} is called the 'universal hotness manifold'." To this information there needs to be added a sense of greater hotness; this sense can be had, independently of calorimetry , of thermodynamics , and of properties of particular materials, from Wien's displacement law of thermal radiation :
2926-559: A development shop for projects the main company would not normally undertake. Their original logo was simply the HP logo turned upside down, forming something approximating "dy" and thus inspiring the name. Learning that Westinghouse owned a trademark on that name, in 1958 they changed it to Dymec. The company was brought in-house in 1959 to become the Dymec Division, and in November 1967 was renamed
3080-439: A digital display or input to a computer. Thermometers may be described as empirical or absolute. Absolute thermometers are calibrated numerically by the thermodynamic absolute temperature scale. Empirical thermometers are not in general necessarily in exact agreement with absolute thermometers as to their numerical scale readings, but to qualify as thermometers at all they must agree with absolute thermometers and with each other in
3234-491: A few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors , DSPs , and microcontrollers , use boolean algebra to process "one" and "zero" signals . Among the most advanced integrated circuits are the microprocessors or " cores ", used in personal computers, cell-phones, etc. Several cores may be integrated together in
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#17328523742913388-453: A front panel. The new L and A series models had HP-IB interface ability, but as with all HP systems at that time, the blinking LED lights were removed from the front panel. Despite customer demands for a real-time ability and HP R&D's efforts using an installable real-time card, the RTE-A OS was not as good at real-time operations as RTE on a 21MX. This was an important reason this computer
3542-432: A function of absolute thermodynamic temperature alone. A small enough hole in the wall of the cavity emits near enough blackbody radiation of which the spectral radiance can be precisely measured. The walls of the cavity, provided they are completely opaque and poorly reflective, can be of any material indifferently. This provides a well-reproducible absolute thermometer over a very wide range of temperatures, able to measure
3696-423: A hardwired CPU: In November 1968 the company released the 2000A Timeshare System, later known as HP 2000/Access. This was based on the 2116B (a 2116A with an expanded 8k core memory) running HP Time-Shared BASIC and used a separate 2114 as a terminal server . T-S BASIC allowed multiple user accounts to be created with up to 16 users logged in at once. Later models of the 2000, B through F, used newer versions of
3850-408: A layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet ) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. Each device is tested before packaging using automated test equipment (ATE), in
4004-409: A lower-cost offering for commercial users. A further simplified version shipped as the 2114A in 1968, which had only eight slots, leaving room for the power supply to be incorporated into the main chassis. The 2115 and 2114 also lacked the extensive DMA control of the 2116, removed some of the mathematical operations, and ran at slightly slower speeds. These are the original models using core memory and
4158-399: A medically accurate body temperature. Traditional thermometers were all non-registering thermometers. That is, the thermometer did not hold the temperature reading after it was moved to a place with a different temperature. Determining the temperature of a pot of hot liquid required the user to leave the thermometer in the hot liquid until after reading it. If the non-registering thermometer
4312-428: A number of steps for the p–n junction isolation of transistors on a chip, MOSFETs required no such steps but could be easily isolated from each other. Its advantage for integrated circuits was pointed out by Dawon Kahng in 1961. The list of IEEE milestones includes the first integrated circuit by Kilby in 1958, Hoerni's planar process and Noyce's planar IC in 1959. The earliest experimental MOS IC to be fabricated
4466-405: A platinum resistance thermometer with a digital display to 0.1 °C (its precision) which has been calibrated at 5 points against national standards (−18, 0, 40, 70, 100 °C) and which is certified to an accuracy of ±0.2 °C. According to British Standards , correctly calibrated, used and maintained liquid-in-glass thermometers can achieve a measurement uncertainty of ±0.01 °C in
4620-420: A process known as wafer testing , or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die . Each good die (plural dice , dies , or die ) is then connected into a package using aluminium (or gold) bond wires which are thermosonically bonded to pads , usually found around the edge of the die. Thermosonic bonding was first introduced by A. Coucoulas which provided
4774-421: A rate predicted by Moore's law , leading to large-scale integration (LSI) with hundreds of transistors on a single MOS chip by the late 1960s. Following the development of the self-aligned gate (silicon-gate) MOSFET by Robert Kerwin, Donald Klein and John Sarace at Bell Labs in 1967, the first silicon-gate MOS IC technology with self-aligned gates , the basis of all modern CMOS integrated circuits,
HP 2100 - Misplaced Pages Continue
4928-524: A recipe for building a "Fountain which trickles by the Action of the Sun's Rays," a more elaborate version of Philo's pneumatic experiment but which worked on the same principle of heating and cooling air to move water around. Translations of the ancient work Pneumatics were introduced to late 16th century Italy and studied by many, including Galileo Galilei , who had read it by 1594. The Roman Greek physician Galen
5082-407: A reliable means of forming these vital electrical connections to the outside world. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Industrial CT scanning can also be used. Test cost can account for over 25% of the cost of fabrication on lower-cost products, but can be negligible on low-yielding, larger, or higher-cost devices. As of 2022 ,
5236-504: A scale of 8 degrees. The word comes from the Greek words θερμός , thermos , meaning "hot" and μέτρον, metron , meaning "measure". The above instruments suffered from the disadvantage that they were also barometers , i.e. sensitive to air pressure. In 1629, Joseph Solomon Delmedigo , a student of Galileo and Santorio in Padua, published what is apparently the first description and illustration of
5390-426: A sealed liquid-in-glass thermometer. It is described as having a bulb at the bottom of a sealed tube partially filled with brandy. The tube had a numbered scale. Delmedigo did not claim to have invented this instrument. Nor did he name anyone else as its inventor. In about 1654, Ferdinando II de' Medici, Grand Duke of Tuscany (1610–1670) did produce such an instrument, the first modern-style thermometer, dependent on
5544-426: A semiconductor to modulate its electronic properties. Doping is the process of adding dopants to a semiconductor material. Since a CMOS device only draws current on the transition between logic states , CMOS devices consume much less current than bipolar junction transistor devices. A random-access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even
5698-420: A single sense/inhibit line , they fit an 8 kW memory onto a single expansion card. This was used starting in the 2116C models. In 1971, the updated 2100A replaced the entire existing 211x lineup. The overall system was similar to the earlier models and continued to be based on core memory. Physically, it most resembled the 2114, as the power supply was built-in and it had limited internal expansion. However,
5852-859: A single IC or chip. Digital memory chips and application-specific integrated circuits (ASICs) are examples of other families of integrated circuits. In the 1980s, programmable logic devices were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a chip to be programmed to do various LSI-type functions such as logic gates , adders and registers . Programmability comes in various forms – devices that can be programmed only once , devices that can be erased and then re-programmed using UV light , devices that can be (re)programmed using flash memory , and field-programmable gate arrays (FPGAs) which can be programmed at any time, including during operation. Current FPGAs can (as of 2016) implement
6006-532: A single die. A technique has been demonstrated to include microfluidic cooling on integrated circuits, to improve cooling performance as well as peltier thermoelectric coolers on solder bumps, or thermal solder bumps used exclusively for heat dissipation, used in flip-chip . The cost of designing and developing a complex integrated circuit is quite high, normally in the multiple tens of millions of dollars. Therefore, it only makes economic sense to produce integrated circuit products with high production volume, so
6160-495: A single layer on one side of a chip of silicon in a flat two-dimensional planar process . Researchers have produced prototypes of several promising alternatives, such as: As it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules / chiplets , three-dimensional integrated circuits , package on package , High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce
6314-508: A single machine, while the higher density system based on 16-pin Mostek parts could be supported by replacing the normal 21-X/2 controller with the 21-X/1. The entire 2100 series was replaced in 1974 with the first of these 21MX series machines. Using the highest-density parts, the new machines could support up to 1.2 MB in the largest models. When the CPU was further upgraded in 1976, the new models became
HP 2100 - Misplaced Pages Continue
6468-405: A single memory word, which, used properly, can significantly speed operations. A total of 39 register operations are included, which are broken down into shift-and-rotate instructions, and the alter-and-skip instructions, indicated by bit 10, while bit 11 indicates whether this is being applied to register A or B. There are two general classes of register instructions, the shift-and-rotate group and
6622-482: A six-pin device. Radios with the Loewe 3NF were less expensive than other radios, showing one of the advantages of integration over using discrete components , that would be seen decades later with ICs. Early concepts of an integrated circuit go back to 1949, when German engineer Werner Jacobi ( Siemens AG ) filed a patent for an integrated-circuit-like semiconductor amplifying device showing five transistors on
6776-568: A temperature sensor (e.g. the bulb of a mercury-in-glass thermometer or the pyrometric sensor in an infrared thermometer ) in which some change occurs with a change in temperature; and (2) some means of converting this change into a numerical value (e.g. the visible scale that is marked on a mercury-in-glass thermometer or the digital readout on an infrared model). Thermometers are widely used in technology and industry to monitor processes, in meteorology , in medicine ( medical thermometer ), and in scientific research. While an individual thermometer
6930-435: A thermometric material must have three properties: (1) Its heating and cooling must be rapid. That is to say, when a quantity of heat enters or leaves a body of the material, the material must expand or contract to its final volume or reach its final pressure and must reach its final temperature with practically no delay; some of the heat that enters can be considered to change the volume of the body at constant temperature, and
7084-403: A thermoscope and a thermometer is that the latter has a scale. A thermometer is simply a thermoscope with a scale. ... I propose to regard it as axiomatic that a “meter” must have a scale or something equivalent. ... If this is admitted, the problem of the invention of the thermometer becomes more straightforward; that of the invention of the thermoscope remains as obscure as ever. Given this,
7238-463: A universality character of thermodynamic equilibrium, that it has the universal property of producing blackbody radiation. There are various kinds of empirical thermometer based on material properties. Many empirical thermometers rely on the constitutive relation between pressure, volume and temperature of their thermometric material. For example, mercury expands when heated. If it is used for its relation between pressure and volume and temperature,
7392-505: A year after Kilby, Robert Noyce at Fairchild Semiconductor invented the first true monolithic IC chip. More practical than Kilby's implementation, Noyce's chip was made of silicon , whereas Kilby's was made of germanium , and Noyce's was fabricated using the planar process , developed in early 1959 by his colleague Jean Hoerni and included the critical on-chip aluminum interconnecting lines. Modern IC chips are based on Noyce's monolithic IC, rather than Kilby's. NASA's Apollo Program
7546-466: Is a fundamental character of temperature and thermometers. As it is customarily stated in textbooks, taken alone, the so-called " zeroth law of thermodynamics " fails to deliver this information, but the statement of the zeroth law of thermodynamics by James Serrin in 1977, though rather mathematically abstract, is more informative for thermometry: "Zeroth Law – There exists a topological line M {\displaystyle M} which serves as
7700-695: Is able to measure degrees of hotness, the readings on two thermometers cannot be compared unless they conform to an agreed scale. Today there is an absolute thermodynamic temperature scale. Internationally agreed temperature scales are designed to approximate this closely, based on fixed points and interpolating thermometers. The most recent official temperature scale is the International Temperature Scale of 1990 . It extends from 0.65 K (−272.5 °C; −458.5 °F) to approximately 1,358 K (1,085 °C; 1,985 °F). Sparse and conflicting historical records make it difficult to pinpoint
7854-404: Is called the latent heat of expansion at constant temperature ; and the rest of it can be considered to change the temperature of the body at constant volume, and is called the specific heat at constant volume . Some materials do not have this property, and take some time to distribute the heat between temperature and volume change. (2) Its heating and cooling must be reversible. That is to say,
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#17328523742918008-404: Is created, sucking liquid up into the tube. Any changes in the position of the liquid will now indicate whether the air in the sphere is getting hotter or colder. Translations of Philo's experiment from the original ancient Greek were utilized by Robert Fludd sometime around 1617 and used as the basis for his air thermometer. In his book, Pneumatics , Hero of Alexandria (10–70 AD) provides
8162-546: Is given credit for introducing two concepts important to the development of a scale of temperature and the eventual invention of the thermometer. First, he had the idea that hotness or coldness may be measured by "degrees of hot and cold." He also conceived of a fixed reference temperature, a mixture of equal amounts of ice and boiling water, with four degrees of heat above this point and four degrees of cold below. 16th century physician Johann Hasler developed body temperature scales based on Galen's theory of degrees to help him mix
8316-405: Is handled in the two A and B registers, each 16 bits wide. The registers are also accessible at memory locations 0 and 1, respectively. This means that one can load a value into an accumulator using the normal register-save operation, for instance, LDA 1 will LoaD the value of the A register into memory location 1, thereby copying the value of A into B. In addition to the A and B registers,
8470-493: Is high because the IC's components switch quickly and consume comparatively little power because of their small size and proximity. The main disadvantage of ICs is the high initial cost of designing them and the enormous capital cost of factory construction. This high initial cost means ICs are only commercially viable when high production volumes are anticipated. An integrated circuit is defined as: A circuit in which all or some of
8624-403: Is not masked out by a higher-priority interrupt, 1 to 12. Another key feature of the 2100 series is a separate direct memory access controller that uses cycle stealing to access memory when the CPU is not using it, during the times when it is performing internal calculations for instance. Using this feature, lengthy I/O processes can be completed while the CPU works on other problems. The system
8778-681: Is obsolete. An early attempt at combining several components in one device (like modern ICs) was the Loewe 3NF vacuum tube first made in 1926. Unlike ICs, it was designed with the purpose of tax avoidance , as in Germany, radio receivers had a tax that was levied depending on how many tube holders a radio receiver had. It allowed radio receivers to have a single tube holder. One million were manufactured, and were "a first step in integration of radioelectronic devices". The device contained an amplifier , composed of three triodes, two capacitors and four resistors in
8932-517: Is set up by sending an instruction to the DMA controller using the I/O commands; the DMA controller is channel 6, and is initially sent an instruction containing the number of the I/O device that wants to use DMA, whether it is an input (write to memory from device) or output (read from memory to device), the starting location in memory for the data, and the number of words. This setup code is often installed into one of
9086-452: Is set, this indicates "indirect" addressing instead of "direct". In Direct mode, the address in the instruction is the address of the operand, while in Indirect mode, the address was a pointer to another memory location that contained the address of the operand. One could set bit 15 on that location as well, allowing the indirection to be of any required depth, ending when one of the locations has
9240-471: Is smaller than a micrometre , and new methods and materials have to be used. Nanothermometry is used in such cases. Nanothermometers are classified as luminescent thermometers (if they use light to measure temperature) and non-luminescent thermometers (systems where thermometric properties are not directly related to luminescence). Thermometers used specifically for low temperatures. Various thermometric techniques have been used throughout history such as
9394-476: The dual in-line package (DIP), first in ceramic and later in plastic, which is commonly cresol - formaldehyde - novolac . In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by
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#17328523742919548-488: The non-recurring engineering (NRE) costs are spread across typically millions of production units. Modern semiconductor chips have billions of components, and are far too complex to be designed by hand. Software tools to help the designer are essential. Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems , including integrated circuits. The tools work together in
9702-498: The periodic table of the chemical elements were identified as the most likely materials for a solid-state vacuum tube . Starting with copper oxide , proceeding to germanium , then silicon , the materials were systematically studied in the 1940s and 1950s. Today, monocrystalline silicon is the main substrate used for ICs although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs , lasers , solar cells and
9856-544: The small-outline integrated circuit (SOIC) package – a carrier which occupies an area about 30–50% less than an equivalent DIP and is typically 70% thinner. This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline package (TSOP) packages became the most common for high pin count devices, though PGA packages are still used for high-end microprocessors . Ball grid array (BGA) packages have existed since
10010-407: The status register . Additionally, there is the 16-bit S/D (Switch/Display) register, which is used for input and output from the front panel. Certain areas of memory are reserved for special purposes, like locations 0 and 1 used by the accumulators. Additional words in the lowest 64-locations in memory are used for direct memory access (DMA), and vectored interrupts (see below). In later models,
10164-416: The switching power consumption per transistor goes down, while the memory capacity and speed go up, through the relationships defined by Dennard scaling ( MOSFET scaling ). Because speed, capacity, and power consumption gains are apparent to the end user, there is fierce competition among the manufacturers to use finer geometries. Over the years, transistor sizes have decreased from tens of microns in
10318-503: The very large-scale integration (VLSI) of more than 10,000 transistors on a single chip. At first, MOS-based computers only made sense when high density was required, such as aerospace and pocket calculators . Computers built entirely from TTL, such as the 1970 Datapoint 2200 , were much faster and more powerful than single-chip MOS microprocessors such as the 1972 Intel 8008 until the early 1980s. Advances in IC technology, primarily smaller features and larger chips, have allowed
10472-513: The "21MX E-Series" and the original models retroactively became the "21MX M-Series". The main difference between the M and E was that the E used clever timing to improve the speed to about twice that of the M. A wider variety of machine styles were released as part of the 21MX series, including smaller systems with four slots and larger ones with 9 or 14 slots. The 21MX series featured a memory management unit and semiconductor memory expandable to 1,048,576 words (one megaword ). The bit displays on
10626-513: The 10 least significant bits are the "displacement" pointing to a single word within the 1,024-word page. With the DMS system in the 21MX series, the upper 5 bits are instead used to select one of 32 registers, each of which holds 12 bits. The least significant 10 bits of the register are then placed in front of the original 10-bit displacement to produce a 20-bit address. The two most significant bits are used to implement memory protection . Most processing
10780-413: The 1960s, the size, speed, and capacity of chips have progressed enormously, driven by technical advances that fit more and more transistors on chips of the same size – a modern chip may have many billions of transistors in an area the size of a human fingernail. These advances, roughly following Moore's law , make the computer chips of today possess millions of times the capacity and thousands of times
10934-425: The 1970s. Flip-chip Ball Grid Array packages, which allow for a much higher pin count than other package types, were developed in the 1990s. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over
11088-423: The 1974 introduction of the first of the 21MX series machines. This stood for the "21-M" processor and the "21-X" memory, as the memory control systems were separated from the CPU in order to provide flexibility in case the chosen 4k parts were changed during production. This proved useful in practice as the machines were shipped with memories using either Motorola or Texas Instruments parts, and they could be mixed in
11242-482: The 22 nm node (Intel) or 16/14 nm nodes. Mono-crystal silicon wafers are used in most applications (or for special applications, other semiconductors such as gallium arsenide are used). The wafer need not be entirely silicon. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium or copper) tracks deposited on them. Dopants are impurities intentionally introduced to
11396-457: The CPU also includes the M register which holds the current memory address, and the T register which holds the value at that address. The P register is used as the program counter and automatically incremented with every instruction, but it is also used as the base address for some memory accesses (see below) that are calculated and placed in M. There are also two one-bit registers, Overflow and Extend, in modern terms, these bits would be considered
11550-423: The CPU was rebuilt with microcode that could be user-programmed, added hardware multiply and divide, and it added a simple memory protection system, which caused a high-priority interrupt when triggered. A two-channel DMA controller provided higher throughput. An optional floating-point unit was also available. Front panel buttons were illuminated by small incandescent lamps that burned out with use. The use of
11704-428: The CPU. Although this made the expansion cards incompatible with the earlier models for the first time, it also greatly improved overall performance. These models lacked the memory management unit. The L-Series was, in turn, replaced in 1982 with the "HP 1000 A-Series", which included a new "Lightning" CPU design that reached 1 MIPS , and the even faster "Magic" CPU at 3 MIPS. A wide variety of different models
11858-531: The Flag bit with STF and then setting the C bit using STC . The hardware notices this pattern and begins its operation. When the operation is complete, the device sets the Flag bit and then the program loads the resulting data from the card using the LI* instruction, or sends it to the card with OT* . The actual data transfer is normally accomplished using the interrupt system. Memory locations 4 through 63 (decimal) hold
12012-502: The HP 2100 series in 1971, and then again as the 21MX series in 1974 when the magnetic-core memory was replaced with semiconductor memory. All of these models were also packaged as the HP 2000 series, combining a 2100-series machine with optional components in order to run the BASIC programming language in a multi-user time sharing fashion. HP Time-Shared BASIC was popular in the 1970s, and many early BASIC programs were written on or for
12166-446: The ISA with add-on hardware, adding, for instance, floating point instructions or additional integer math and memory instructions, but these would fall into the same three basic categories. Memory instructions use four bits for the instruction, and two more for special flags, for a total of six bits of the 16-bit word. This leaves room for a 10-bit address in the instruction, stored in the least significant bits (LSBs), 0 to 9. If bit 15
12320-472: The P register, the C(urrent) page of memory, allowing memory to be accessed as 32 pages of 1024 words. Thus 2,048 words can be addressed at any given time; 1,024 of them within page zero and another 1,024 within the same page as the instruction performing the reference. Register instructions do not require an address, and thus have more free bits to work with. This is used to pack up four or eight instructions into
12474-496: The Palo Alto Division. Dymec originally made a variety of products for the HP family, but over time became primarily an integrator, building test equipment and similar systems that were used by HP. In 1964, Kay Magleby and Paul Stoft began experimenting with the use of PDP-5 and PDP-8 computers to act as controllers for their complex test systems, but they felt the machines would require changes to truly suit their needs. At
12628-456: The Renaissance period. In the 3rd century BC, Philo of Byzantium documented his experiment with a tube submerged in a container of liquid on one end and connected to an air-tight, hollow sphere on the other. When air in the sphere is heated with a candle or by exposing it to the sun, expanding air exits the sphere and generates bubbles in the vessel. As air in the sphere cools, a partial vacuum
12782-402: The absolute temperature of a body inside the cavity. A thermometer is called primary or secondary based on how the raw physical quantity it measures is mapped to a temperature. As summarized by Kauppinen et al., "For primary thermometers the measured property of matter is known so well that temperature can be calculated without any unknown quantities. Examples of these are thermometers based on
12936-462: The accumulators. The instruction format starts with the bits "1000" in the most significant bits, followed by a single bit indicating which register to use (A=0, B=1), followed by a "1", the H/C flag bit, and then three bits for the instruction and the remaining six bits for the I/O device ID, or channel, allowing up to 64 devices. Some device numbers are used by the system itself. I/O is initiated by clearing
13090-443: The addresses of routines to jump to when an interrupt is fired, providing 60 interrupt levels. Location 4 through 7 are hard-wired to power failures, parity check errors, and in later models memory protection errors. Locations 8 and up are user-accessible interrupt vectors, mapped to an I/O channel and arranged in priority order. So if I/O device 13 produced an interrupt, the CPU jumps to the location in memory location 13, but only if it
13244-459: The alter-and-skip. The first is used for basic bitwise manipulation of the values in a register and can have up to four instructions per word, although the two instructions in the middle are always a CLE,SLA/B (clear E, skip if A/B is zero). The second group has eight instructions that perform increments on the registers and then a conditional branch. These are normally used to implement loops. Input/Output instructions normally communicate through
13398-429: The appropriate amount of medicine for patients. In the late 16th and early 17th centuries, several European scientists, notably Galileo Galilei and Italian physiologist Santorio Santorio developed devices with an air-filled glass bulb, connected to a tube, partially filled with water. As the air in the bulb warms or cools, the height of the column of water in the tube falls or rises, allowing an observer to compare
13552-719: The circuit elements are inseparably associated and electrically interconnected so that it is considered to be indivisible for the purposes of construction and commerce. In strict usage, integrated circuit refers to the single-piece circuit construction originally known as a monolithic integrated circuit , which comprises a single piece of silicon. In general usage, circuits not meeting this strict definition are sometimes referred to as ICs, which are constructed using many different technologies, e.g. 3D IC , 2.5D IC , MCM , thin-film transistors , thick-film technologies , or hybrid integrated circuits . The choice of terminology frequently appears in discussions related to whether Moore's Law
13706-473: The components of the electronic circuit are completely integrated". The first customer for the new invention was the US Air Force . Kilby won the 2000 Nobel Prize in physics for his part in the invention of the integrated circuit. However, Kilby's invention was not a true monolithic integrated circuit chip since it had external gold-wire connections, which would have made it difficult to mass-produce. Half
13860-402: The current height of the water to previous heights to detect relative changes of the heat in the bulb and its immediate environment. Such devices, with no scale for assigning a numerical value to the height of the liquid, are referred to as a thermoscope because they provide an observable indication of sensible heat (the modern concept of temperature was yet to arise). The difference between
14014-455: The defining points in the International Temperature Scale of 1990 , though in practice the melting point of water is more commonly used than its triple point, the latter being more difficult to manage and thus restricted to critical standard measurement. Nowadays manufacturers will often use a thermostat bath or solid block where the temperature is held constant relative to a calibrated thermometer. Other thermometers to be calibrated are put into
14168-473: The desktop Datapoint 2200 were built from bipolar integrated circuits, either TTL or the even faster emitter-coupled logic (ECL). Nearly all modern IC chips are metal–oxide–semiconductor (MOS) integrated circuits, built from MOSFETs (metal–oxide–silicon field-effect transistors). The MOSFET invented at Bell Labs between 1955 and 1960, made it possible to build high-density integrated circuits . In contrast to bipolar transistors which required
14322-418: The die must pass through the material electrically connecting the die to the package, through the conductive traces (paths) in the package, through the leads connecting the package to the conductive traces on the printed circuit board . The materials and structures used in the path these electrical signals must travel have very different electrical properties, compared to those that travel to different parts of
14476-536: The diffusion of impurities into silicon. A precursor idea to the IC was to create small ceramic substrates (so-called micromodules ), each containing a single miniaturized component. Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which seemed very promising in 1957, was proposed to the US Army by Jack Kilby and led to the short-lived Micromodule Program (similar to 1951's Project Tinkertoy). However, as
14630-448: The division. Sales of the 2100 series remained strong; the 6000th shipped in August 1973, the 8000th in February 1974, and its 10,000th in February 1975. They were declared obsolete in 1978. In 1972, the division decided to move to 4kbit SRAM memory chips in place of core. These were about twice as fast as contemporary low-cost core, and much smaller, allowing 32kword machines to be built in
14784-412: The earlier systems meant there was room for much more memory, into the megaword range. However, the CPU's use of 15-bit addresses limited the size to 32kwords. To address the desire for larger systems, HP developed the "Dynamic Mapping System", or DMS. DMS expanded the address format from 15 to 20 bits, allowing a maximum of 1,048,576 words, a dramatic expansion of the original system. These changes led to
14938-524: The early 1970s to 10 nanometers in 2017 with a corresponding million-fold increase in transistors per unit area. As of 2016, typical chip areas range from a few square millimeters to around 600 mm , with up to 25 million transistors per mm . The expected shrinking of feature sizes and the needed progress in related areas was forecast for many years by the International Technology Roadmap for Semiconductors (ITRS). The final ITRS
15092-541: The entire die rather than being confined to the die periphery. BGA devices have the advantage of not needing a dedicated socket but are much harder to replace in case of device failure. Intel transitioned away from PGA to land grid array (LGA) and BGA beginning in 2004, with the last PGA socket released in 2014 for mobile platforms. As of 2018 , AMD uses PGA packages on mainstream desktop processors, BGA packages on mobile processors, and high-end desktop and server microprocessors use LGA packages. Electrical signals leaving
15246-446: The equation of state of a gas, on the velocity of sound in a gas, on the thermal noise voltage or current of an electrical resistor, and on the angular anisotropy of gamma ray emission of certain radioactive nuclei in a magnetic field ." In contrast, "Secondary thermometers are most widely used because of their convenience. Also, they are often much more sensitive than primary ones. For secondary thermometers knowledge of
15400-580: The equivalent of millions of gates and operate at frequencies up to 1 GHz . Analog ICs, such as sensors , power management circuits , and operational amplifiers (op-amps), process continuous signals , and perform analog functions such as amplification , active filtering , demodulation , and mixing . ICs can combine analog and digital circuits on a chip to create functions such as analog-to-digital converters and digital-to-analog converters . Such mixed-signal circuits offer smaller size and lower cost, but must account for signal interference. Prior to
15554-527: The expansion of a liquid and independent of air pressure. Many other scientists experimented with various liquids and designs of thermometer. However, each inventor and each thermometer was unique — there was no standard scale . Early attempts at standardization added a single reference point such as the freezing point of water. The use of two references for graduating the thermometer is said to have been introduced by Joachim Dalence in 1668, although Christiaan Huygens (1629–1695) in 1665 had already suggested
15708-545: The field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count . The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized
15862-562: The first showing a scale and thus constituting a thermometer was by Santorio Santorio in 1625. This was a vertical tube, closed by a bulb of air at the top, with the lower end opening into a vessel of water. The water level in the tube was controlled by the expansion and contraction of the air, so it was what we would now call an air thermometer. The word thermometer (in its French form) first appeared in 1624 in La Récréation Mathématique by Jean Leurechon , who describes one with
16016-421: The following way: given any two bodies isolated in their separate respective thermodynamic equilibrium states, all thermometers agree as to which of the two has the higher temperature, or that the two have equal temperatures. For any two empirical thermometers, this does not require that the relation between their numerical scale readings be linear, but it does require that relation to be strictly monotonic . This
16170-472: The form of magnetic core memory was falling from dollars to pennies per bit, while implementing processor registers using transistors or small-scale integration remained very expensive. This favored designs with few registers and most storage in RAM, which in turn influenced the instruction set architecture (ISA) to use a memory-memory or memory- accumulator design. This basic concept was first widely introduced in
16324-412: The foundry model, fabless companies (like Nvidia ) only design and sell ICs and outsource all manufacturing to pure play foundries such as TSMC . These foundries may offer IC design services. The earliest integrated circuits were packaged in ceramic flat packs , which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to
16478-470: The front panel buttons used small red light-emitting diodes (LEDs), instead of the burnout-prone incandescent bulbs used in earlier versions. The 21MX ran the HP RTE (real time) operating system (OS). They started out as refrigerator-sized 19-inch rackmount systems with lights and switches on the front panels. The last models would use a 1-chip processor and fit under a desk using a console terminal rather than
16632-493: The highest 64 words of available memory are reserved for the boot loader . The original instruction set contained 68 or 70 instructions. All 68 instructions in the standard instruction set are 16 bits long. Most execute in one memory cycle, or 16 clock cycles, although indirect addressing and the ISZ can use up to 36 cycles. Conditional branching is done with a conditional skip-over-one instruction, that one instruction normally being
16786-414: The highest or lowest temperature recorded until manually re-set, e.g., by shaking down a mercury-in-glass thermometer, or until an even more extreme temperature is experienced. Electronic registering thermometers may be designed to remember the highest or lowest temperature, or to remember whatever temperature was present at a specified point in time. Thermometers increasingly use electronic means to provide
16940-568: The highest-speed integrated circuits. It took decades to perfect methods of creating crystals with minimal defects in semiconducting materials' crystal structure . Semiconductor ICs are fabricated in a planar process which includes three key process steps – photolithography , deposition (such as chemical vapor deposition ), and etching . The main process steps are supplemented by doping and cleaning. More recent or high-performance ICs may instead use multi-gate FinFET or GAAFET transistors instead of planar ones, starting at
17094-579: The idea to the public at the Symposium on Progress in Quality Electronic Components in Washington, D.C. , on 7 May 1952. He gave many symposia publicly to propagate his ideas and unsuccessfully attempted to build such a circuit in 1956. Between 1953 and 1957, Sidney Darlington and Yasuo Tarui ( Electrotechnical Laboratory ) proposed similar chip designs where several transistors could share
17248-400: The interrupt vectors, automating the process. The DMS has separate tables for the CPU and DMA system, so DMA can load data into separate parts of extended memory. HP supplied a three-pass assembler for the machine, using a column-delimited format. The first area, on the left of the line of code, is the label, which has to start in column 1 if present. Next comes the instruction mnemonic, then
17402-401: The invention of the thermometer to any single person or date with certitude. In addition, given the many parallel developments in the thermometer's history and its many gradual improvements over time, the instrument is best viewed not as a single invention, but an evolving technology . Early pneumatic devices and ideas from antiquity provided inspiration for the thermometer's invention during
17556-421: The late 1990s, radios could not be fabricated in the same low-cost CMOS processes as microprocessors. But since 1998, radio chips have been developed using RF CMOS processes. Examples include Intel's DECT cordless phone, or 802.11 ( Wi-Fi ) chips created by Atheros and other companies. Modern electronic component distributors often further sub-categorize integrated circuits: The semiconductors of
17710-433: The material must be able to be heated and cooled indefinitely often by the same increment and decrement of heat, and still return to its original pressure, volume and temperature every time. Some plastics do not have this property; (3) Its heating and cooling must be monotonic. That is to say, throughout the range of temperatures for which it is intended to work, At temperatures around about 4 °C, water does not have
17864-478: The measured property is not sufficient to allow direct calculation of temperature. They have to be calibrated against a primary thermometer at least at one temperature or at a number of fixed temperatures. Such fixed points, for example, triple points and superconducting transitions, occur reproducibly at the same temperature." Thermometers can be calibrated either by comparing them with other calibrated thermometers or by checking them against known fixed points on
18018-441: The nearest 10 °C or more. Clinical thermometers and many electronic thermometers are usually readable to 0.1 °C. Special instruments can give readings to one thousandth of a degree. However, this precision does not mean the reading is true or accurate, it only means that very small changes can be observed. A thermometer calibrated to a known fixed point is accurate (i.e. gives a true reading) at that point. The invention of
18172-433: The number of MOS transistors in an integrated circuit to double every two years, a trend known as Moore's law. Moore originally stated it would double every year, but he went on to change the claim to every two years in 1975. This increased capacity has been used to decrease cost and increase functionality. In general, as the feature size shrinks, almost every aspect of an IC's operation improves. The cost per transistor and
18326-610: The parameters. The rest of the line can be used for a comment. The assembler allows basic mathematical expressions to be written directly, instead of using mnemonics, and also includes a number of pseudo-instructions like ORG to set the base address of the program. In addition to the assembler and associated linker , the machines initially shipped with a FORTRAN 66 compiler , the operating system , and I/O drivers. Over time, additional languages were added including BASIC, ALGOL , FORTRAN IV and FORTRAN 77 . Integrated circuit An integrated circuit ( IC ), also known as
18480-400: The platform, most notably the seminal Star Trek that was popular during the early home computer era. The People's Computer Company published their programs in HP 2000 format. The introduction of the HP 3000 in 1974 provided high-end competition to the 2100 series; the entire line was renamed as the HP 1000 in 1977 and positioned as real-time computers . A greatly redesigned version
18634-416: The possible inventors of the thermometer are usually considered to be Galileo, Santorio, Dutch inventor Cornelis Drebbel , or British mathematician Robert Fludd . Though Galileo is often said to be the inventor of the thermometer, there is no surviving document that he actually produced any such instrument. The first clear diagram of a thermoscope was published in 1617 by Giuseppe Biancani (1566 – 1624);
18788-493: The project was gaining momentum, Kilby came up with a new, revolutionary design: the IC. Newly employed by Texas Instruments , Kilby recorded his initial ideas concerning the integrated circuit in July 1958, successfully demonstrating the first working example of an integrated circuit on 12 September 1958. In his patent application of 6 February 1959, Kilby described his new device as "a body of semiconductor material … wherein all
18942-568: The property (3), and is said to behave anomalously in this respect; thus water cannot be used as a material for this kind of thermometry for temperature ranges near 4 °C. Gases, on the other hand, all have the properties (1), (2), and (3)(a)(α) and (3)(b)(α). Consequently, they are suitable thermometric materials, and that is why they were important in the development of thermometry. According to Preston (1894/1904), Regnault found constant pressure air thermometers unsatisfactory, because they needed troublesome corrections. He therefore built
19096-463: The range 0 to 100 °C, and a larger uncertainty outside this range: ±0.05 °C up to 200 or down to −40 °C, ±0.2 °C up to 450 or down to −80 °C. Thermometers utilize a range of physical effects to measure temperature. Temperature sensors are used in a wide variety of scientific and engineering applications, especially measurement systems. Temperature systems are primarily either electrical or mechanical, occasionally inseparable from
19250-464: The same bath or block and allowed to come to equilibrium, then the scale marked, or any deviation from the instrument scale recorded. For many modern devices calibration will be stating some value to be used in processing an electronic signal to convert it to a temperature. The precision or resolution of a thermometer is simply to what fraction of a degree it is possible to make a reading. For high temperature work it may only be possible to measure to
19404-413: The same die. As a result, they require special design techniques to ensure the signals are not corrupted, and much more electric power than signals confined to the die itself. Thermometer A thermometer is a device that measures temperature (the hotness or coldness of an object) or temperature gradient (the rates of change of temperature in space). A thermometer has two important elements: (1)
19558-411: The same reading)? Reproducible temperature measurement means that comparisons are valid in scientific experiments and industrial processes are consistent. Thus if the same type of thermometer is calibrated in the same way its readings will be valid even if it is slightly inaccurate compared to the absolute scale. An example of a reference thermometer used to check others to industrial standards would be
19712-403: The seminal 12-bit PDP-8, which spawned many similar designs like the 2100. In the 2100, addresses are 15-bits long, allowing a total of 32k 16-bit words of memory (64 KB in modern terms). The smallest addressable unit of memory is a 16-bit word; it has no instructions that fetch a single 8-bit byte. The address is broken into two parts, the 5 most significant bits refer to one of 32 "pages", while
19866-474: The size of the transistors. Such techniques are collectively known as advanced packaging . Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip modules while 3D describes approaches where dies are stacked in one way or another, such as package on package and high bandwidth memory. All approaches involve 2 or more dies in a single package. Alternatively, approaches such as 3D NAND stack multiple layers on
20020-427: The speed of the computer chips of the early 1970s. ICs have three main advantages over circuits constructed out of discrete components: size, cost and performance. The size and cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance
20174-405: The state of a suitably selected particular material and its temperature. Only some materials are suitable for this purpose, and they may be considered as "thermometric materials". Radiometric thermometry, in contrast, can be only slightly dependent on the constitutive relations of materials. In a sense then, radiometric thermometry might be thought of as "universal". This is because it rests mainly on
20328-468: The success of the line had propelled HP to become the fourth largest manufacturer in the minicomputer space, trailing only DEC, IBM , and Data General . In 1980, the "HP 1000 L-Series" was introduced. This used a new processor based on HP's large-scale integration silicon on sapphire process. Additionally, the expansion cards were also equipped with their own processors that allowed them to access main memory and conduct input/output without bothering
20482-568: The system which they control (as in the case of a mercury-in-glass thermometer). Thermometers are used in roadways in cold weather climates to help determine if icing conditions exist. Indoors, thermistors are used in climate control systems such as air conditioners , freezers, heaters , refrigerators , and water heaters . Galileo thermometers are used to measure indoor air temperature, due to their limited measurement range. Such liquid crystal thermometers (which use thermochromic liquid crystals) are also used in mood rings and used to measure
20636-400: The technology to measure temperature led to the creation of scales of temperature . In between fixed calibration points, interpolation is used, usually linear. This may give significant differences between different types of thermometer at points far away from the fixed points. For example, the expansion of mercury in a glass thermometer is slightly different from the change in resistance of
20790-428: The temperature of a bath of thermal radiation is proportional , by a universal constant, to the frequency of the maximum of its frequency spectrum ; this frequency is always positive, but can have values that tend to zero . Another way of identifying hotter as opposed to colder conditions is supplied by Planck's principle , that when a process of isochoric adiabatic work is the sole means of change of internal energy of
20944-408: The temperature of water in fish tanks. Fiber Bragg grating temperature sensors are used in nuclear power facilities to monitor reactor core temperatures and avoid the possibility of nuclear meltdowns . Nanothermometry is an emergent research field dealing with the knowledge of temperature in the sub-micrometric scale. Conventional thermometers cannot measure the temperature of an object which
21098-407: The temperature scale. The best known of these fixed points are the melting and boiling points of pure water. (Note that the boiling point of water varies with pressure, so this must be controlled.) The traditional way of putting a scale on a liquid-in-glass or liquid-in-metal thermometer was in three stages: Other fixed points used in the past are the body temperature (of a healthy adult male) which
21252-408: The time, Digital Equipment Corporation (DEC) was still a small company and a takeover target. David Packard found Ken Olsen too difficult to deal with, and such plans went nowhere. Looking for another design they could purchase, Packard was led to the five-person Data Systems, Inc. (DSI) of Detroit. DSI was owned by Union Carbide , and when Packard asked how it was that Union Carbide came to own
21406-582: The underlying CPU as they were introduced. Some models used low-end versions of the same CPU as the terminal server; the 2000F, for instance, used a 2100S as the main CPU and primary storage controller, while a 2100A acted as the terminal server. The B, C & F models were dual-processor. In the last version, the 2000F, a 2100S and 2100A CPU were used, with the 2100A connected to up to 32 serial terminals via serial multiplexer interfaces. In spite of its relatively high costs – the 2000F cost $ 105,000 in 1974, or about $ 649,000 in 2023 – it
21560-492: The use of graduations based on the melting and boiling points of water as standards and, in 1694, Carlo Renaldini (1615–1698) proposed using them as fixed points along a universal scale. In 1701, Isaac Newton (1642–1726/27) proposed a scale of 12 degrees between the melting point of ice and body temperature . In 1714, scientist and inventor Daniel Gabriel Fahrenheit invented a reliable thermometer, using mercury instead of alcohol and water mixtures . In 1724, he proposed
21714-400: The world of electronics . Computers, mobile phones, and other home appliances are now essential parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer processors and microcontrollers . Very-large-scale integration was made practical by technological advancements in semiconductor device fabrication . Since their origins in
21868-476: Was Herman Boerhaave (1668–1738). In 1866, Sir Thomas Clifford Allbutt (1836–1925) invented a clinical thermometer that produced a body temperature reading in five minutes as opposed to twenty. In 1999, Dr. Francesco Pompei of the Exergen Corporation introduced the world's first temporal artery thermometer, a non-invasive temperature sensor which scans the forehead in about two seconds and provides
22022-479: Was Mike Mayfield's Star Trek of 1971. Its popularity made its dialect of BASIC a lingua franca and many BASIC listings were normally provided in that format; the People's Computer Company published their programs in HP 2000 format. HP systems were also used for teaching statistics, regression analysis , and economics. The 2000 and 2100 designations have been reused: The HP 2100 was designed in an era when RAM in
22176-401: Was a 16-transistor chip built by Fred Heiman and Steven Hofstein at RCA in 1962. General Microelectronics later introduced the first commercial MOS integrated circuit in 1964, a 120-transistor shift register developed by Robert Norman. By 1964, MOS chips had reached higher transistor density and lower manufacturing costs than bipolar chips. MOS chips further increased in complexity at
22330-441: Was developed at Fairchild Semiconductor by Federico Faggin in 1968. The application of MOS LSI chips to computing was the basis for the first microprocessors , as engineers began recognizing that a complete computer processor could be contained on a single MOS LSI chip. This led to the inventions of the microprocessor and the microcontroller by the early 1970s. During the early 1970s, MOS integrated circuit technology enabled
22484-438: Was hard to kill. Many companies use real-time operations to take a measurements and control processes – turn on or off a pump, heater, a valve, speed up or slow down a motor, etc. At the end of 1977, the entire line was renamed as the "HP 1000", becoming the "HP 1000 M-Series" and "HP 1000 E-Series". The next year the "HP 1000 F-Series" was introduced, which was an E-Series with an added floating point unit. By 1978,
22638-468: Was introduced in 1979 as the 1000 L-Series , using CMOS large scale integration chips and introducing a desk-side tower case model. This was the first version to break backward compatibility with previous 2100-series expansion cards. The final upgrade was the A-series , with new processors capable of more than 1 MIPS performance, with the final A990 released in 1990. HP formed Dynac in 1956 to act as
22792-505: Was issued in 2016, and it is being replaced by the International Roadmap for Devices and Systems . Initially, ICs were strictly electronic devices. The success of ICs has led to the integration of other technologies, in an attempt to obtain the same advantages of small size and low cost. These technologies include mechanical devices, optics, and sensors. As of 2018 , the vast majority of all transistors are MOSFETs fabricated in
22946-525: Was originally used by Fahrenheit as his upper fixed point (96 °F (35.6 °C) to be a number divisible by 12) and the lowest temperature given by a mixture of salt and ice, which was originally the definition of 0 °F (−17.8 °C). (This is an example of a frigorific mixture .) As body temperature varies, the Fahrenheit scale was later changed to use an upper fixed point of boiling water at 212 °F (100 °C). These have now been replaced by
23100-422: Was produced, including desk-side towers, and a variety of different size rack-mount systems. A low-end A400 model was introduced in 1986, and the final high-end A990 released in 1990. Each addressable up to 32 MB of RAM. The HP 2000 series was introduced in 1969, sold until June 1978, and was supported until 1985. Versions of many seminal BASIC games were written on, or ported to, the platform. Notable among these
23254-419: Was provided by having each card slot be assigned a fixed interrupt vector that called the appropriate device driver . As the machine entered the market, it quickly became clear it was selling much more rapidly into the business data processing market than the originally targeted instrumentation market. This led to the introduction of the 2115A in 1967, which removed much of the expansion capabilities to make
23408-420: Was removed from the hot liquid, then the temperature indicated on the thermometer would immediately begin changing to reflect the temperature of its new conditions (in this case, the air temperature). Registering thermometers are designed to hold the temperature indefinitely, so that the thermometer can be removed and read at a later time or in a more convenient place. Mechanical registering thermometers hold either
23562-516: Was the first minicomputer to offer time-shared BASIC, which made it very popular in the early-to-mid 1970s. Through the 1970s, the lineup was constantly improved with new models that remained compatible in software and expansion with the original 2116. In early 1970, Fred Allard, formerly of Ampex 's Memory Core Division, was asked to design a new magnetic-core memory system for the systems rather than continue purchasing them from Ampex. Using newer 18 mil cores, down from 22 mil, and using
23716-480: Was the largest single consumer of integrated circuits between 1961 and 1965. Transistor–transistor logic (TTL) was developed by James L. Buie in the early 1960s at TRW Inc. TTL became the dominant integrated circuit technology during the 1970s to early 1980s. Dozens of TTL integrated circuits were a standard method of construction for the processors of minicomputers and mainframe computers . Computers such as IBM 360 mainframes, PDP-11 minicomputers and
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