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19-470: Crystal HD includes single chip high-definition advanced media processors BCM70012 (codenamed Link) and BCM70015 (codenamed Flea); these chips are available on mini PCIe cards . The BCM970012 supports hardware decoding of H.264/MPEG-4 AVC , VC-1 , WMV9 and MPEG-2 and the BCM970015 additionally supports DivX 3.11, 4.1, 5.X, 6.X and Xvid . VP8 , VP9 , Daala and HEVC are not supported. Crystal HD

38-469: A PLCC extractor facilitates the removal of a PLCC from a socket. PLCCs continue to be used for a wide variety of device types, which would include memory, processors, controllers, ASICs, DSPs, etc. It is particularly common for read-only memories, as it provides an easily swappable socketed chip. Applications range from consumer products through automotive and aerospace. A leadless chip carrier ( LCC ) has no " leads ", but instead has rounded pins through

57-451: A chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If

76-547: A device driver , which provides the video interfaces. One of these interfaces is then used by end-user software, for example Media Player Classic or GStreamer , to access CrystalHD. Broadcom published a Linux device driver under GNU General Public License (GPL) version 2. Broadcom also published application and library source code on a royalty-free basis under the GNU Lesser General Public License (LGPL), version 2.1 Crystal HD can be accessed through

95-403: A heatsink . The tiny leads coming off through-hole electronic components are also often called pins ; in ball grid array packages, they are in form of small spheres, and are therefore called "balls" . Many electrical components such as capacitors , resistors , and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for

114-566: A PLCC socket or surface-mounted . PLCC sockets may in turn be surface mounted, or use through-hole technology . The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the reflow process, or to allow for component replacement without reworking. Using a PLCC socket may be necessary in situations where the device requires stand-alone programming, such as some flash memory devices. Some through-hole sockets are designed for prototyping with wire wrapping . A specialized tool called

133-439: A metal pad ( surface-mount technology ) that is designed to connect two locations electrically . Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter ; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as

152-516: A postmolded variant that was soon adopted by most major semiconductor companies. The JEDEC trade group started a task force in 1981 to categorize PLCCs, with the MO-047 standard released in 1984 for square packages and the MO-052 standard released in 1985 for rectangular packages. The PLCC uses a "J"- lead with pin spacings of 0.05" (1.27 mm). The metal strip forming the lead is wrapped around and under

171-573: Is found in Intel Atom based machines, such as the Dell Inspiron Mini 10 HP Slate 500 or ExoPC , ASUS Eee Keyboard . The commercial relevancy of dedicated video decoding accelerators was ended by the launch of the Intel Core i-series , featuring an integrated GPU with hardware video decoding (formerly only widespreadly available in discrete GPUs ). The Crystal HD SIP core must be supported by

190-651: The Video Acceleration API interface via an experimental driver (however, it cannot be recovered from the linked archive). A GStreamer plugin is available. Crystal HD support is available in FFmpeg and MPlayer when compiled with the corresponding option. It could be added to first generation Apple TV when OSMC is installed, although support was dropped in 2017. Broadcom published a device driver for Microsoft Windows that provides accelerated DirectShow renderers filters. Chip carrier In electronics ,

209-499: The PLCC's more efficient use of board surface area. The heatspreader versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material sets are now qualified standards. A PLCC circuit may either be installed in

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228-464: The edge of the package, resembling the letter J in cross-section. Lead counts range from 20 to 84. PLCC packages can be square or rectangular. Body widths range from 0.35" to 1.15". The PLCC "J" Lead configuration requires less board space versus equivalent gull leaded components, which have flat leads that extend out perpendicularly to the narrow edge of the package. The PLCC is preferred over DIP style chip carriers when lead counts exceed 40 pins due to

247-415: The edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic. Lead (electronics) In electronics , a lead ( / ˈ l iː d / ) or pin is an electrical connector consisting of a length of wire or

266-452: The largest ball grid array packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead). Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame , wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from

285-469: The leads extend beyond the package, the preferred description is " flat pack ". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC . Other forms are proprietary to one or two manufacturers. Sometimes

304-400: The physical construction of the leads. The leads are often metal connections that run from the rest of the circuit to the materials that each component is made of. This design results in a very small capacitance between the ends of the leads where they connect to the device and very small inductances and resistances along each lead. Because the impedance of each component is a function of

323-403: The pins, if any, formed from that lead frame) are occasionally made from Invar or similar alloys, due to their low coefficient of thermal expansion . For many circuit designs it can be assumed that the leads do not contribute to the electrical effects of individual components. However, this assumption begins to break down at higher frequencies and at very small scales. These effects come from

342-489: The plastic are then either "cut long" and bent to form through-hole pins, or "cut short" and bent to form surface-mount leads. Such lead frames are used for surface mount packages with leads – such as Small Outline Integrated Circuit Quad Flat Package  – and for through-hole packages such as dual in-line package  – and even for so-called "leadless" or "no‑lead" packages  – such as Quad Flat No‑leads package . The lead frame (and therefore

361-455: The term "chip carrier" is used to refer generically to any package for an integrated circuit. Types of chip-carrier package are usually referred to by initialisms and include: A plastic-leaded chip carrier ( PLCC ) has a rectangular plastic housing. It is a reduced cost evolution of the ceramic leadless chip carrier (CLCC). A premolded PLCC was originally released in 1976, but did not see much market adoption. Texas Instruments later released

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