A photoresist (also known simply as a resist ) is a light-sensitive material used in several processes, such as photolithography and photoengraving , to form a patterned coating on a surface. This process is crucial in the electronics industry .
51-620: ASML may refer to: ASML Holding , a Dutch company that supplies photolithography systems for the semiconductor industry Atlanta, Stone Mountain and Lithonia Railway , United States (ASM&L; reporting mark ASML ) Aisha Steel Mills Limited , a Pakistani steel manufacturing company Abstract State Machine Language , a programming language See also [ edit ] [REDACTED] Search for "asml" on Misplaced Pages. All pages with titles beginning with ASML All pages with titles containing ASML Topics referred to by
102-468: A solvated electron , or a freed electron that may react with other constituents of the solution. It typically travels a distance on the order of many nanometers before being contained; such a large travel distance is consistent with the release of electrons through thick oxide in UV EPROM in response to ultraviolet light. This parasitic exposure would degrade the resolution of the photoresist; for 193 nm
153-406: A coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas where the mask was not placed. A BARC coating (Bottom Anti-Reflectant Coating) may be applied before the photoresist
204-443: A concern. The dissociation energy for a C-C bond is 3.6 eV. Secondary electrons generated by primary ionizing radiation have energies sufficient to dissociate this bond, causing scission. In addition, the low-energy electrons have a longer photoresist interaction time due to their lower speed; essentially the electron has to be at rest with respect to the molecule in order to react most strongly via dissociative electron attachment, where
255-651: A consortium, including Intel and two other U.S. chipmakers, in order to exploit fundamental research conducted by the US Department of Energy . Because the CRADA it operates under is funded by the US taxpayer, licensing must be approved by Congress. It collaborated with the Belgian IMEC and Sematech and turned to Carl Zeiss in Germany for its need of mirrors. In 2000, ASML acquired
306-573: A goal of at least 20% of world production of semiconductors in Europe by 2030, and support via a European Alliance on semiconductors. After reporting earnings in July 2021, the company said they had a near monopoly for machines used by TSMC and Samsung Electronics to make the advanced chips. In February 2023, ASML claimed that a former worker in China "allegedly" stole information about the company's technology. This
357-470: A printing press. The general process is applying photoresist, exposing image to ultraviolet rays, and then etching to remove the copper-clad substrate. This includes specialty photonics materials, MicroElectro-Mechanical Systems ( MEMS ), glass printed circuit boards, and other micropatterning tasks. Photoresist tends not to be etched by solutions with a pH greater than 3. This application, mainly applied to silicon wafers and silicon integrated circuits
408-410: A remarkable achievement given that human hair is approximately 80,000 nanometers thick. Extreme ultraviolet lithography (EUV) machines produce light in the 13.5 nm wavelength range when a high-energy laser is focused on microscopic droplets of molten tin to produce a plasma , which then emits EUV light. The light is bounced off Zeiss mirrors onto the surface of a silicon wafer to deliver
459-432: A substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind
510-617: A wavelength of 193 nm. As of 2011 , an average lithography machine cost € 27 million . Deep ultraviolet (DUV) lithography devices from ASML use light that penetrates the UV spectrum to print the tiny features that form the microchip's structure. EUV lithography is a critical technology used to create the smallest and most complex chip designs. ASML holds a near-monopoly in the EUV market, with no significant direct competitors. The company's machines are capable of etching patterns as small as 8 nanometers,
561-402: Is a type of photoresist in which the portion of the photoresist that is exposed to light becomes insoluble in the photoresist developer. The unexposed portion of the photoresist is dissolved by the photoresist developer. Modulation transfer function MTF (modulation transfer function is the ratio of image intensity modulation and object intensity modulation and it is a parameter that indicates
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#1732890761153612-439: Is applied, to avoid reflections from occurring under the photoresist and to improve the photoresist's performance at smaller semiconductor nodes. Conventional photoresists typically consist of 3 components: resin (a binder that provides physical properties such as adhesion, chemical resistance, etc), sensitizer (which has a photoactive compound), and solvent (which keeps the resist liquid). Positive: light will weaken
663-485: Is associated with the outgassing and contamination from the photoresist. Photoresists can also be exposed by electron beams, producing the same results as exposure by light. The main difference is that while photons are absorbed, depositing all their energy at once, electrons deposit their energy gradually, and scatter within the photoresist during this process. As with high-energy wavelengths, many transitions are excited by electron beams, and heating and outgassing are still
714-410: Is based on epoxy-based oligomer. The common product name is SU-8 photoresist , and it was originally invented by IBM , but is now sold by Microchem and Gersteltec . One unique property of SU-8 is that it is very difficult to strip. As such, it is often used in applications where a permanent resist pattern (one that is not strippable, and can even be used in harsh temperature and pressure environments)
765-591: Is covered with a film of light-sensitive material ( photoresist ). This procedure is repeated dozens of times on a single wafer. The photoresist is then further processed to create the actual electronic circuits on the silicon. The optical imaging that ASML's machines deal with is used in the fabrication of nearly all integrated circuits and, as of 2011, ASML had 67 percent of the worldwide sales of lithography machines. ASML's competition consisted of Ultratech , Canon and Nikon , MKS Instruments , Lam Research and Cadence Design Systems . Since immersion lithography
816-512: Is designated High-NA as it will increase the numerical aperture (NA) from 0.33 to 0.55, and each system is expected to cost $ 300 million. ASML's EUV machines have experienced a significant surge in demand in recent years, driven by modern electronics' increasing complexity and performance requirements. This surge in demand has translated into steady revenue growth for the company, reaching $ 30 billion in 2023, up from $ 13 billion five years earlier. The company, originally named ASM Lithography,
867-450: Is different from Wikidata All article disambiguation pages All disambiguation pages ASML Holding ASML Holding N.V. (commonly shortened to ASML , originally standing for Advanced Semiconductor Materials Lithography ) is a Dutch multinational corporation founded in 1984. ASML specializes in the development and manufacturing of photolithography machines which are used to produce computer chips . As of 2023 it
918-436: Is important not only to increase photoresist sensitivity and throughput, but also to limit line edge roughness due to shot noise statistics. However, the acid diffusion length is itself a potential resolution limiter. In addition, too much diffusion reduces chemical contrast, leading again to more roughness. The following reactions are an example of commercial chemically amplified photoresists in use today: The e represents
969-577: Is in Veldhoven , Netherlands and the location for research, development, manufacturing and assembly. ASML employs more than 42,000 people from 143 nationalities and relies on a network of nearly 5,000 tier 1 suppliers. ASML has a worldwide customer base and over sixty service points in sixteen countries. It has offices in the Netherlands, the United States, Belgium, France, Germany, Ireland, Israel, Italy,
1020-406: Is inorganic and metal-free. Therefore, exposed HSQ provides a low dielectric constant (low-k) Si-rich oxide. A comparative study against other photoresists was reported in 2015 (Dow Corning HSQ). Microcontact printing was described by Whitesides Group in 1993. Generally, in this techniques, an elastomeric stamp is used to generate two-dimensional patterns, through printing the “ink” molecules onto
1071-485: Is named ASML as its official name and not an abbreviation. It was founded in 1984 as a joint venture between the Dutch companies ASM and Philips . Nowadays it is a public company. When the company became independent in 1988, it was decided that changing the name was not desirable, and ASML became the official company name. ASML released the lithography system PAS 5500 in 1991, which became an extremely successful platform for
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#17328907611531122-460: Is needed for a device. Mechanism of epoxy-based polymer is shown in 1.2.3 SU-8. SU-8 is prone to swelling at smaller feature sizes, which has led to the development of small-molecule alternatives that are capable of obtaining higher resolutions than SU-8. In 2016, OSTE Polymers were shown to possess a unique photolithography mechanism, based on diffusion-induced monomer depletion, which enables high photostructuring accuracy. The OSTE polymer material
1173-451: Is the contrast ratio. Intensity (I) is related to energy by E = I*t. A positive photoresist is a type of photoresist in which a portion is exposed to light and becomes soluble to the photoresist developer. The unexposed portion of the photoresist remains insoluble in the photoresist developer. Some examples of positive photoresists are: PMMA (polymethylmethacrylate) single-component Two-component DQN resists: A negative photoresist
1224-432: Is the largest supplier for the semiconductor industry and the sole supplier in the world of extreme ultraviolet lithography (EUV) photolithography machines that are required to manufacture the most advanced chips. As of November 2024 , ASML was the fourth most valuable company in Europe, and the second most valued European tech company, with a market capitalization of about US$ 264 billion. ASML's corporate headquarters
1275-462: Is the most efficient way to achieve higher resolution. Photoresists are most commonly used at wavelengths in the ultraviolet spectrum or shorter (<400 nm). For example, diazonaphthoquinone (DNQ) absorbs strongly from approximately 300 nm to 450 nm. The absorption bands can be assigned to n-π* (S0–S1) and π-π* (S1–S2) transitions in the DNQ molecule. In the deep ultraviolet (DUV) spectrum,
1326-467: Is the only company to manufacture them. ASML's best-selling EUV product has been the TWINSCAN NXE:3600D, which costs up to $ 200 million. Shipping the machine the size of a truck requires moving 180 tons with three Boeing 747s . ASML is working on the next generation of EUV systems, with the first shipments to customers for R&D purposes expected to take place at the end of 2023. The platform
1377-601: The Trump administration tried to block the sale of ASML technology to China, but as of 2021, the ongoing global chip shortage as well as the "technological cold war" between the US and China had been a business opportunity for ASML. In November 2020, ASML revealed that it had acquired the German optical glassmaking firm Berliner Glas Group in order to meet increasing need for components for its EUV systems. In July 2021, European Commissioner Thierry Breton , visited ASML and announced
1428-459: The Brainport region. Together they run various initiatives like soccer training camps for school children, the development of interactive programs for teaching, assisting community members in need or who are new to the region, as well as supporting a vitality program that is online. [REDACTED] Media related to ASML at Wikimedia Commons Photoresist The process begins by coating
1479-453: The Dutch national unemployment fund to prevent even larger layoffs. Two and a half years later, ASML expected a record-high revenue. In July 2012, Intel announced a deal to invest $ 4.1 billion into ASML in exchange for 15% ownership, in order to speed up the transition from 300 mm to 450 mm wafers and further development of EUV lithography. This deal was without exclusive rights to future ASML products and, as of July 2012, ASML
1530-447: The Netherlands' Institute for Human Rights ruled that despite the country's constitution prohibiting discrimination based on nationality, ASML was allowed to reject job applications from residents of countries subject to sanctions under the U.S. Export Administration Regulations (such as Cuba, Iran, North Korea, and Syria) in order to remain compliant with U.S. law. In January 2024, the Dutch government placed further restrictions on
1581-489: The Silicon Valley Group (SVG), a US lithography equipment manufacturer also licensed for EUV research results, in a bid to supply 193 nm scanners to Intel Corp . In 2002, it became the largest supplier of photolithography systems. At the end of 2008, ASML experienced a large drop in sales, which led management to cut the workforce by about 1000 worldwide, mostly contract workers and to apply for support from
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1632-559: The United Kingdom, China, Hong Kong, Japan, South Korea, Malaysia, Singapore, and Taiwan. The company is listed on both the AEX and NASDAQ Stock Exchanges, as ASML. It is also a component of the Euro Stoxx 50 and NASDAQ-100 . ASML produces the photolithography machines used in the production of computer chips. In these machines, patterns are optically imaged onto a silicon wafer that
1683-406: The capability of an optical system. The following table is based on generalizations which are generally accepted in the microelectromechanical systems (MEMS) fabrication industry. Based on the chemical structure of photoresists, they can be classified into three types: photopolymeric, photodecomposing, and photocrosslinking photoresist. In lithography, decreasing the wavelength of light source
1734-483: The company. The PAS 5500 was first utilized by Micron Technology , which was one of the world's largest producers of computer memory and storage, and ASML's largest customer at that time. The success of the PAS 5500 line propelled ASML into strong competition with Canon and Nikon , who were the leaders in that era of the lithography market. In 1997, ASML began studying a shift to using extreme ultraviolet and in 1999 joined
1785-509: The designs for the chip. In 2009, the IMEC research center in Belgium produced the world's first functional 22 nm CMOS Static random-access memory memory cells with a prototype EUV lithography machine. After decades of development, ASML shipped the first production extreme ultraviolet lithography machine in either 2011 or 2013. As of 2022 , ASML has shipped around 140 EUV systems, and it
1836-677: The electron comes to rest at the molecule, depositing all its kinetic energy. The resulting scission breaks the original polymer into segments of lower molecular weight, which are more readily dissolved in a solvent, or else releases other chemical species (acids) which catalyze further scission reactions (see the discussion on chemically amplified resists below). It is not common to select photoresists for electron-beam exposure. Electron beam lithography usually relies on resists dedicated specifically to electron-beam exposure. Physical, chemical, and optical properties of photoresists influence their selection for different processes. The primary properties of
1887-462: The former employee who "allegedly" stole data about ASML's technology subsequently went to work for Huawei . In March 2023, the Dutch government placed restrictions on chip exports in order to protect national security. This measure affected ASML as one of the most important companies in the global microchip supply chain. Export license requirements came into effect in September 2023. In June 2023,
1938-481: The novolac resin, but upon exposure to light, the dissolution rate increases even beyond that of pure novolac. The mechanism by which unexposed DNQ inhibits novolac dissolution is not well understood, but is believed to be related to hydrogen bonding (or more exactly diazocoupling in the unexposed region). DNQ-novolac resists are developed by dissolution in a basic solution (usually 0.26N tetramethylammonium hydroxide (TMAH) in water). One very common negative photoresist
1989-413: The optical resolution is the limiting factor anyway, but for electron beam lithography or EUVL it is the electron range that determines the resolution rather than the optics. One very common positive photoresist used with the I, G and H-lines from a mercury-vapor lamp is based on a mixture of diazonaphthoquinone (DNQ) and novolac resin (a phenol formaldehyde resin). DNQ inhibits the dissolution of
2040-414: The photoresist are resolution capability, process dose and focus latitude s required for curing, and resistance to reactive ion etching. Other key properties are sensitivity, compatibility with tetramethylammonium hydroxide (TMAH), adhesion, environmental stability, and shelf life. Photoresists used in production for DUV and shorter wavelengths require the use of chemical amplification to increase
2091-523: The photoresist. From about 5 eV to about 20 eV, photoionization of outer " valence band " electrons is the main absorption mechanism. Above 20 eV, inner electron ionization and Auger transitions become more important. Photon absorption begins to decrease as the X-ray region is approached, as fewer Auger transitions between deep atomic levels are allowed for the higher photon energy. The absorbed energy can drive further reactions and ultimately dissipates as heat. This
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2142-432: The resist, and create a hole Negative: light will toughen the resist and create an etch resistant mask. To explain this in graphical form you may have a graph on Log exposure energy versus fraction of resist thickness remaining. The positive resist will be completely removed at the final exposure energy and the negative resist will be completely hardened and insoluble by the end of exposure energy. The slope of this graph
2193-405: The same term [REDACTED] This disambiguation page lists articles associated with the title ASML . If an internal link led you here, you may wish to change the link to point directly to the intended article. Retrieved from " https://en.wikipedia.org/w/index.php?title=ASML&oldid=1217109212 " Category : Disambiguation pages Hidden categories: Short description
2244-538: The sensitivity to the exposure energy. This is done in order to combat the larger absorption at shorter wavelengths. Chemical amplification is also often used in electron-beam exposures to increase the sensitivity to the exposure dose. In the process, acids released by the exposure radiation diffuse during the post-exposure bake step. These acids render surrounding polymer soluble in developer. A single acid molecule can catalyze many such ' deprotection ' reactions; hence, fewer photons or electrons are needed. Acid diffusion
2295-547: The shipment of some advanced chip-making equipment to China. On 6 September 2024, the Dutch government tightened export controls on certain ASML chipmaking equipment, aligning its policy with U.S. restrictions to limit China's access to advanced technology amid safety and geopolitical concerns. ASML became a sponsor of the PSV soccer club in 2019 together with Philips . VDL Groep , Royal Swinkels Family Brewers and Jumbo Supermarkets from
2346-485: The surface of a solid substrate. Step 1 for microcontact printing. A scheme for the creation of a polydimethylsiloxane (PDMS) master stamp. Step 2 for microcontact printing A scheme of the inking and contact process of microprinting lithography. The manufacture of printed circuit boards is one of the most important uses of photoresist. Photolithography allows the complex wiring of an electronic system to be rapidly, economically, and accurately reproduced as if run off
2397-488: The π-π* electronic transition in benzene or carbon double-bond chromophores appears at around 200 nm. Due to the appearance of more possible absorption transitions involving larger energy differences, the absorption tends to increase with shorter wavelength, or larger photon energy . Photons with energies exceeding the ionization potential of the photoresist (can be as low as 5 eV in condensed solutions) can also release electrons which are capable of additional exposure of
2448-459: Was first proposed by Burn-Jeng Lin in the 1970s, ASML cooperated with Taiwan Semiconductor Manufacturing (TSMC). In 2004, TSMC began commercial production of 90 nanometer semiconductor nodes using ASML immersion lithography. As of 2011, their high-end TWINSCAN NXT:1950i system was used for producing features down to 32 nanometres at up to 200 wafers per hour, using a water immersion lens and an argon fluoride laser that produces light at
2499-540: Was not the first time that ASML was allegedly linked with an intellectual property breach connected to China. In its 2021 annual report , ASML mentioned that Dongfang Jingyuan Electron Limited "was actively marketing products in China that could potentially infringe on ASML's IP rights." At the time, the United States Department of Commerce expressed concern about economic espionage against ASML. In October 2023, Dutch newspaper NRC Handelsblad reported that
2550-774: Was offering another 10% of the shares to other companies. As part of their EUV strategy, ASML announced the acquisition of DUV and EUV sources manufacturer Cymer in October 2012. In November 2013, ASML paused development of 450 mm lithography equipment, citing uncertain timing of chipmaker demand. In 2015, ASML suffered intellectual property theft . A number of employees had been found stealing confidential data from its Silicon Valley software subsidiary that develops software for machine optimization. In June 2016, ASML announced their plans to acquire Taiwan-based Hermes Microvision Inc. for about $ 3.1 billion to add technology for creating smaller and more advanced semiconductors . In 2018,
2601-619: Was originally invented at the KTH Royal Institute of Technology , but is now sold by Mercene Labs . Whereas the material has properties similar to those of SU8, OSTE has the specific advantage that it contains reactive surface molecules, which make this material attractive for microfluidic or biomedical applications. HSQ is a common negative resist for e-beam , but also useful for photolithography. Originally invented by Dow Corning (1970), and now produced ( 2017 ) by Applied Quantum Materials Inc. ( AQM ). Unlike other negative resists, HSQ
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