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101-573: Zen is a family of computer processor microarchitectures from AMD , first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), Ryzen Threadripper (workstation and high end desktop), and Epyc (server). The first generation Zen was launched with the Ryzen 1000 series of CPUs (codenamed Summit Ridge) in February 2017. The first Zen-based preview system

202-455: A Neural Processing Unit (NPU) powered by XDNA architecture, a Radeon graphics engine, and Ryzen processor cores. Introduced on the Ryzen 7040 mobile series in mid 2023, it can be used to run neural network applications such as camera background effects, voice recognition, photo artifact removal and skin smoothing. Neural network tasks can be computationally intensive to run on a general-purpose CPU, resulting in significant energy usage and

303-460: A three-state buffer for each device that drives the bus), unidirectional buses (always driven by a single source, such as the way the address bus on simpler computers is always driven by the memory address register ), and individual control lines. Very simple computers have a single data bus organization  – they have a single three-state bus . The diagram of more complex computers usually shows multiple three-state buses, which help

404-519: A +19 percent IPC improvement over Zen 2, while being built on the same 7 nm TSMC node with out-of-the-box operating boost frequencies exceeding 5 GHz for the first time since AMD's Piledriver. This was followed by an unusually short stop-gap release of Ryzen 6000 mobile-only series processors on January 4, 2022, using the modestly changed Zen 3+ core on a 6 nm process by TSMC, with claims up to +15 percent performance uplift gains from frequency rather than IPC. The Ryzen 7000 series

505-474: A business plan or a specific roadmap. Instead, a small team inside AMD saw an opportunity to develop the benefits of Ryzen and EPYC CPU roadmaps, so as to give AMD the lead in desktop CPU performance. After some progress was made in their spare time, the project was greenlit and put in an official roadmap by 2016. Ryzen AI is the brand name for AMD's AI technology, based on intellectual property from AMD's acquisition of Xilinx . AMD Ryzen AI can work across

606-427: A complete redesign that marked the return of AMD to the high-end central processing unit (CPU) market, offering a product range capable of competing with Intel. Having more processing cores, Ryzen processors offer greater multi-threaded performance at the same price point relative to Intel's Core processors. The Zen architecture delivers more than +52 percent improvement in instructions per cycle (clock) over

707-465: A die shrink and several revisions of the Bulldozer architecture, performance and power efficiency failed to catch up with Intel's competing products. Consequently, all of this forced AMD to completely abandon the entire high-end CPU market (including desktop , laptops , and server /enterprise) until Ryzen's release in 2017. Ryzen is the consumer-level implementation of the newer Zen microarchitecture ,

808-449: A discrete GPU and not for gaming. The operating power of AM5 is increased to 170 W from AM4's 105 W, with the absolute maximum power draw or "Power Package Tracking" (PPT) being 230 W. The Ryzen Threadripper and Threadripper PRO 7000 series were released on November 21, 2023. Threadripper features up to 64 cores, while Threadripper PRO 7000 features up to 96 cores. These new HEDT and workstation processor lineups both utilize

909-571: A doubling of the L3 cache size, a re-optimized L1 instruction cache, a larger micro-operations cache, double the AVX/AVX2 bandwidth, improved branch prediction, and better instruction pre-fetching. The 6, 8 and 12 core CPUs became generally available on July 7, 2019, and 24 core processors were launched in November. The competing Intel Core i9-10980XE processor has only 18 cores and 36 threads. Another competitor,

1010-512: A further enhancement in which the code along the predicted path is not just prefetched but also executed before it is known whether the branch should be taken or not. This can yield better performance when the guess is good, with the risk of a huge penalty when the guess is bad because instructions need to be undone. Even with all of the added complexity and gates needed to support the concepts outlined above, improvements in semiconductor manufacturing soon allowed even more logic gates to be used. In

1111-473: A hub and spoke topology. This approach differs from Zen 1 products, where the same die (Zeppelin) is used in a simple monolithic package for Summit Ridge products (Ryzen 1000 series) or used as interconnected building blocks in an MCM (up to four Zeppelin dies) for first generation Epyc and Threadripper products. For earlier Zen 2 products the IO and uncore functions are performed within this separate IO die, which contains

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1212-405: A huge list of instructions from memory and handing them off to the different execution units that are idle at that point. The results are then collected and re-ordered at the end. The addition of caches reduces the frequency or duration of stalls due to waiting for data to be fetched from the memory hierarchy, but does not get rid of these stalls entirely. In early designs a cache miss would force

1313-530: A larger thermal footprint. An AI accelerator is a coprocessor specifically designed to process neural networks efficiently, similar in concept to other work-offloading specialized processing units such as video decoders or FPGAs . Software support for Microsoft Windows was made widely available in December 2023, while software support for Linux was introduced in January 2024. The first Ryzen 2000 CPUs, based on

1414-417: A leaked slide by Zen father and legendary chip architect Jim Keller who worked with AMD to release the first Ryzen chips in 2017. Jim Keller, leading the new RISC-V team at Tenstorrent, claims absolute dominance in integer performance in a specific INTSPEC benchmark slide which was taken down. Threadripper, which is geared for high-end desktops (HEDT) and professional workstations, was not developed as part of

1515-514: A low-latency interconnect between the cores and to IO. The processing cores in the chiplets are organized in CCXs (Core Complexes) of four cores, linked together to form a single eight core CCD (Core Chiplet Die). Zen 2 also powers a line of mobile and desktop APUs marketed as Ryzen 4000 , as well as fourth generation Xbox consoles and the PlayStation 5 . The Zen 2 core microarchitecture is also used in

1616-413: A new socket, sTR5 , as well as DDR5 and PCIe 5.0. Two new chipsets have been introduced for the sTR5 socket: TRX50 and WRX90 . In conversations with Gamers Nexus regarding the later Ryzen 7 9800X3D, AMD engineers revealed that in 7000X3D series processors, the 1st-generation V-Cache and accompanying structural silicon above the cores effectively act as a thermal insulator, thus inhibiting cooling of

1717-400: A particular branch will be taken. In reality one side or the other of the branch will be called much more often than the other. Modern designs have rather complex statistical prediction systems, which watch the results of past branches to predict the future with greater accuracy. The guess allows the hardware to prefetch instructions without waiting for the register read. Speculative execution is

1818-429: A pipeline could run at the speed of the cache access latency, a much smaller length of time. This allowed the operating frequencies of processors to increase at a much faster rate than that of off-chip memory. One barrier to achieving higher performance through instruction-level parallelism stems from pipeline stalls and flushes due to branches. Normally, whether a conditional branch will be taken isn't known until late in

1919-406: A pipelined fashion and a simple strategy to reduce the number of logic levels in order to reach high operating frequencies; instruction cache-memories compensated for the higher operating frequency and inherently low code density while large register sets were used to factor out as much of the (slow) memory accesses as possible. One of the first, and most powerful, techniques to improve performance

2020-481: A refresh of the Zen 2 Matisse CPU cores, coupled with Radeon Vega GPU cores. They were released only to OEM manufacturers in mid-2020. Unlike Matisse, Renoir does not support PCIe 4.0. Ryzen PRO 4x50G APUs are the same as 4x00G APUs, except they are bundled a Wraith Stealth cooler and are not OEM-only. It is possible this is a listing mistake, since 4x50G CPUs are unavailable on retail (as of Oct 2020) and PRO SKUs are usually

2121-470: A refresh of their pre-existing 22 nm Haswell CPU lineup in the form of "Devil's Canyon", and thus officially ended "tick-tock" as a practice. Those events proved to be incredibly important for AMD, as Intel's inability to further sustain "tick-tock" was critically important in providing both the initial and continually growing market openings for AMD's Ryzen CPUs and, indeed the Zen CPU microarchitecture as

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2222-409: A result from a long latency floating-point operation or other multi-cycle operations. Register renaming refers to a technique used to avoid unnecessary serialized execution of program instructions because of the reuse of the same registers by those instructions. Suppose we have two groups of instruction that will use the same register . One set of instructions is executed first to leave the register to

2323-460: A shift to an multi-chip module (MCM) style "chiplet" package design, and a further shrink to Taiwan Semiconductor Manufacturing Company ( TSMC )'s 7 nm fabrication process. On June 16, 2020 AMD announced new Ryzen 3000XT series processors with increased boost clocks and other small performance enhancements compared to 3000X processors. On October 8, 2020 AMD announced the Zen 3 architecture for their Ryzen 5000 series processors, featuring

2424-452: A single semiconductor chip. See Moore's law . Instruction sets have shifted over the years, from originally very simple to sometimes very complex (in various respects). In recent years, load–store architectures , VLIW and EPIC types have been in fashion. Architectures that are dealing with data parallelism include SIMD and Vectors . Some labels used to denote classes of CPU architectures are not particularly descriptive, especially so

2525-516: A software simulation running test code. If the logic table is placed in a memory and used to actually run a real computer, it is called a microprogram . In some computer designs, the logic table is optimized into the form of combinational logic made from logic gates, usually using a computer program that optimizes logic. Early computers used ad-hoc logic design for control until Maurice Wilkes invented this tabular approach and called it microprogramming. Complicating this simple-looking series of steps

2626-482: A system, attention must be paid to issues such as chip area/cost, power consumption, logic complexity, ease of connectivity, manufacturability, ease of debugging, and testability. To run programs, all single- or multi-chip CPUs: The instruction cycle is repeated continuously until the power is turned off. Historically, the earliest computers were multicycle designs. The smallest, least-expensive computers often still use this technique. Multicycle architectures often use

2727-573: A whole to succeed. Also of note is the release of AMD's Bulldozer microarchitecture in 2011, which despite being a ground up CPU design like Zen, had been designed and optimized for parallel computing above all else, leading to starkly inferior real-world performance in any workload that was not highly multi-threaded , which was still the case for the vast majority at that time. This caused it to be woefully uncompetitive in essentially every area outside of raw multi-thread performance and its use in low power APUs with integrated Radeon graphics. Despite

2828-452: A year later in November 2022. They have up to 96 Zen 4 cores and support both PCIe 5.0 and DDR5. Furthermore, Zen 4 Cloud (a variant of Zen 4), abbreviated to Zen 4c , was also announced. Zen 4c is designed to have significantly greater density than standard Zen 4 while delivering greater power efficiency. This is achieved by redesigning Zen 4's core and cache to maximise density and compute throughput. It has 50% less L3 cache than Zen 4 and

2929-449: Is multithreading . In multithreading, when the processor has to fetch data from slow system memory, instead of stalling for the data to arrive, the processor switches to another program or program thread which is ready to execute. Though this does not speed up a particular program/thread, it increases the overall system throughput by reducing the time the CPU is idle. Conceptually, multithreading

3030-405: Is accessed from there – at considerable time savings, whereas if it is not the processor is "stalled" while the cache controller reads it in. RISC designs started adding cache in the mid-to-late 1980s, often only 4 KB in total. This number grew over time, and typical CPUs now have at least 2 MB, while more powerful CPUs come with 4 or 6 or 12MB or even 32MB or more, with the most being 768MB in

3131-562: Is achieved is through multiprocessing systems, computer systems with multiple CPUs. Once reserved for high-end mainframes and supercomputers , small-scale (2–8) multiprocessors servers have become commonplace for the small business market. For large corporations, large scale (16–256) multiprocessors are common. Even personal computers with multiple CPUs have appeared since the 1990s. With further transistor size reductions made available with semiconductor technology advances, multi-core CPUs have appeared where multiple CPUs are implemented on

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3232-433: Is believed to use TSMC 's 4 nm and 3   nm processes. It will power Ryzen 9000 mainstream desktop processors (codenamed "Granite Ridge"), high-end mobile processors (codenamed "Strix Point"), and Epyc 9005 server processors (codenamed "Turin"). Zen 5c is a compact variant of the Zen 5 core, primarily targeted at hyperscale cloud compute server customers. On August 9, 2024 a vulnerability termed " Sinkclose "

3333-498: Is codenamed Rembrandt . Other noteworthy upgrades are RDNA2 based graphics, PCIe 4.0 and DDR5/LPDDR5 support. Ryzen PRO versions of these processors were announced on April 19, 2022 and use a 6x50 naming scheme. In May 2022 AMD revealed its roadmap showing the Ryzen 7000 series of processors for release later that year, to be based on the Zen 4 architecture in 5 nm (codenamed Raphael ). Included are DDR5 and PCIe 5.0 support as well as

3434-459: Is doubled to 1 MB from Zen 3. The I/O die has moved from a 12 nm process to 6 nm and incorporates an integrated RDNA 2 GPU with two CUs on all Ryzen 7000 models (except the Ryzen 5 7500F), as well as DDR5 and PCIe 5.0 support. DDR4 memory is not supported on Ryzen 7000. According to Gamers Nexus, AMD said that the RDNA GPU was intended for diagnostic and office purposes without using

3535-534: Is equivalent to a context switch at the operating system level. The difference is that a multithreaded CPU can do a thread switch in one CPU cycle instead of the hundreds or thousands of CPU cycles a context switch normally requires. This is achieved by replicating the state hardware (such as the register file and program counter ) for each active thread. A further enhancement is simultaneous multithreading . This technique allows superscalar CPUs to execute instructions from different programs/threads simultaneously in

3636-538: Is not able to clock as high. Bergamo (Epyc 9704 series) has up to 128 Zen 4c cores and is socket-compatible with Genoa. It was released in June 2023. Another server product line that uses Zen 4c cores is Siena (Epyc 8004 series), which has up to 64 cores, uses a different smaller socket and is intended for use cases that favour smaller size, cost, power and thermal footprints over high performance. Both Zen 4 and Zen 4 Cloud are manufactured on TSMC's 5 nm node. In addition to

3737-406: Is often relative to a multicycle design. In a multicycle computer, the computer does the four steps in sequence, over several cycles of the clock. Some designs can perform the sequence in two clock cycles by completing successive stages on alternate clock edges, possibly with longer operations occurring outside the main cycle. For example, stage one on the rising edge of the first cycle, stage two on

3838-495: Is one of the central microarchitectural tasks. Execution units are also essential to microarchitecture. Execution units include arithmetic logic units (ALU), floating point units (FPU), load/store units, branch prediction, and SIMD . These units perform the operations or calculations of the processor. The choice of the number of execution units, their latency and throughput is a central microarchitectural design task. The size, latency, throughput and connectivity of memories within

3939-461: Is the combination of microarchitecture and instruction set architecture. The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the instructions , execution model , processor registers , address and data formats among other things. The microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement

4040-436: Is the fact that the memory hierarchy, which includes caching , main memory and non-volatile storage like hard disks (where the program instructions and data reside), has always been slower than the processor itself. Step (2) often introduces a lengthy (in CPU terms) delay while the data arrives over the computer bus . A considerable amount of research has been put into designs that avoid these delays as much as possible. Over

4141-444: Is the introduction of a unified CCX, which means that each core chiplet is now composed of eight cores with access to 32 MB of L3 cache, instead of two sets of four cores with access to 16 MB of L3 cache each. On April 1, 2022, AMD released the new Ryzen 6000 series for the laptop, using an improved Zen 3+ architecture, bringing RDNA 2 graphics integrated in a APU to the PC for

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4242-468: Is the top of the range, based on Zen 4. It targets "extreme gaming and creator" laptops, i.e. desktop replacement class laptops, with models providing up to 16 cores. It uses a chiplet package built using a separate CCD and I/OD, the same as those used in Raphael desktop processors. Altogether, there are four different CPU architectures, and three different GPU architectures used across the various models in

4343-403: Is the use of instruction pipelining . Early processor designs would carry out all of the steps above for one instruction before moving onto the next. Large portions of the circuitry were left idle at any one step; for instance, the instruction decoding circuitry would be idle during execution and so on. Pipelining improves performance by allowing a number of instructions to work their way through

4444-492: The Zen 2 -based Epyc server CPUs (codename "Rome") were released on August 7, 2019. Zen 2 Matisse products were the first consumer CPUs to use the 7 nm process node, from TSMC . Zen 2 introduced the chiplet based architecture, where desktop, workstation, and server CPUs are all produced as multi-chip modules (MCMs); these Zen 2 products utilise the same core chiplets but are attached to different uncore silicon (different IO dies) in

4545-467: The AM4 platform. In August 2017, AMD launched their Ryzen Threadripper line aimed at the enthusiast and workstation markets. Ryzen Threadripper uses different, larger sockets such as TR4 , sTRX4 , sWRX8 , and sTR5 which support additional memory channels and PCI Express lanes. AMD has moved to the new AM5 platform for consumer desktop Ryzen with the release of Zen 4 products in late 2022. Ryzen uses

4646-494: The control path (which can be said to steer the data). The person designing a system usually draws the specific microarchitecture as a kind of data flow diagram . Like a block diagram , the microarchitecture diagram shows microarchitectural elements such as the arithmetic and logic unit and the register file as a single schematic symbol. Typically, the diagram connects those elements with arrows, thick lines and thin lines to distinguish between three-state buses (which require

4747-591: The microcode . The pipelined datapath is the most commonly used datapath design in microarchitecture today. This technique is used in most modern microprocessors, microcontrollers , and DSPs . The pipelined architecture allows multiple instructions to overlap in execution, much like an assembly line. The pipeline includes several different stages which are fundamental in microarchitecture designs. Some of these stages include instruction fetch, instruction decode, execute, and write back. Some architectures include other stages such as memory access. The design of pipelines

4848-446: The "Zen" CPU microarchitecture, a redesign that returned AMD to the high-end CPU market after a decade of near-total absence since 2006. AMD's primary competitor Intel had largely dominated this market segment starting from the 2006 release of their Core microarchitecture and the Core 2 Duo . Similarly, Intel had abandoned their prior Pentium 4 lineup, as its NetBurst microarchitecture

4949-524: The "mainstream thin-and-light" segment. The Ryzen 7035 series is a refresh of Ryzen 6000 series processors codenamed "Rembrandt-R", targeting "premium thin-and-light" laptops. The Ryzen 7040 series is a new design based on Zen 4, targeting "elite ultrathin" segment. It integrates a built-in AI accelerator (branded as "Ryzen AI") for the first time in an x86 processor, and features RDNA 3 integrated graphics with up to 12 compute units. The Ryzen 7045 series

5050-508: The 12 nm Zen+ microarchitecture, were announced for preorder on April 13, 2018 and launched six days later. Zen+ based Ryzen CPUs are based on Pinnacle Ridge architecture, while Threadripper CPUs are based on the Colfax architecture. The first of the 2000 series of Ryzen Threadripper products, introducing Precision Boost Overdrive technology, followed in August. The Ryzen 7 2700X was bundled with

5151-440: The 2021 models and Barceló for the 2022 models. HX models are unlocked, allowing them to be overclocked if the host device manufacturer has exposed that functionality. Simultaneous multithreading (SMT) is now standard across the lineup unlike the 4000-series Ryzen Mobile. At CES 2022, AMD announced the Ryzen 6000 mobile series. It is based on the Zen 3+ architecture, which is Zen 3 on 6 nm with efficiency improvements, and

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5252-619: The 7 nm Renoir microarchitecture, commercialized as Ryzen 4000. In November 2020, AMD announced the V2000 series of embedded Zen 2 Vega APUs. The desktop Ryzen 5000 series, based on the Zen ;3 microarchitecture, was announced on October 8, 2020. They use the same 7 nm manufacturing process, which has matured slightly. Mainstream Ryzen 5000 CPUs are codenamed Vermeer . Enthusiast/workstation Threadripper 5000 CPUs are codenamed Chagall , initially named Ryzen Threadripper 4000 under

5353-598: The CISC label; many early designs retroactively denoted " CISC " are in fact significantly simpler than modern RISC processors (in several respects). However, the choice of instruction set architecture may greatly affect the complexity of implementing high-performance devices. The prominent strategy, used to develop the first RISC processors, was to simplify instructions to a minimum of individual semantic complexity combined with high encoding regularity and simplicity. Such uniform instructions were easily fetched, decoded and executed in

5454-515: The CPU cores, fabricated on TSMC 's 7FF process, and the I/O, fabricated on GlobalFoundries ' 12LP process, and connects them via Infinity Fabric . The Ryzen 3000 series uses the AM4 socket similar to earlier models and is the first CPU to offer PCI Express 4.0 (PCIe) connectivity. The new architecture offers a 15% instruction-per-clock (IPC) uplift and a reduction in energy usage. Other improvements include

5555-635: The Chinese market were also built under the AMD–Chinese joint venture . Zen+ was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 (codenamed "Pinnacle Ridge") for mainstream desktop systems, and Threadripper 2000 (codenamed "Colfax") for high-end desktop setups. Zen+ used GlobalFoundries' 12 nm process, an enhanced version of their 14 nm node. The Ryzen 3000 series CPUs were released on July 7, 2019, while

5656-495: The Epyc 9004, 9704 and 8004 server processors (Genoa, Bergamo and Siena respectively), Zen 4 also powers Ryzen 7000 mainstream desktop processors (codenamed "Raphael"), high-end mobile processors (codenamed "Dragon Range") and thin-and-light mobile processors (codenamed "Phoenix"). It also powers the Ryzen 8000 G-series of desktop APUs. Zen 5 was shown on AMD's Zen roadmap in May 2022. It

5757-445: The ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be anything from single gates and registers, to complete arithmetic logic units (ALUs) and even larger elements. These diagrams generally separate the datapath (where data is placed) and

5858-458: The Mendocino APU, a 6 nm system on a chip aimed at mainstream mobile and other energy efficient low power computing products. Zen 3 was released on November 5, 2020, using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2

5959-463: The OEM only parts. In April 2022, AMD released the Ryzen 5 4600G to retail, and launched the Ryzen 4000 series of CPUs without integrated graphics, for budget-oriented users. Unlike the Ryzen 3000 series CPUs which are based on "Matisse" cores, these new Ryzen 4000 series desktop CPUs are based on "Renoir" cores and are essentially APUs with the integrated graphics disabled. Zen 2 APUs, based on

6060-715: The V1000 series of embedded Zen+ Vega APUs, based on the Great Horned Owl architecture, with four SKUs. In April 2019 AMD announced another line of embedded Zen+ Vega APUs, namely the Ryzen Embedded R1000 series with two SKUs. On May 27, 2019 at Computex in Taipei , AMD launched its third generation Ryzen processors which use AMD's Zen 2 architecture. For this generation's microarchitectures, Ryzen uses Matisse , while Threadripper uses Castle Peak . The chiplet design separates

6161-483: The cache controller to stall the processor and wait. Of course there may be some other instruction in the program whose data is available in the cache at that point. Out-of-order execution allows that ready instruction to be processed while an older instruction waits on the cache, then re-orders the results to make it appear that everything happened in the programmed order. This technique is also used to avoid other operand dependency stalls, such as an instruction awaiting

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6262-484: The change to the new AM5 socket. On May 23, 2022 at AMD's Computex keynote, AMD officially announced the Ryzen 7000 to be released in Fall 2022, showing a 16-core CPU reaching boost speeds of 5.5 GHz and claiming a 15 percent increase in single-thread performance. The initial four models of the Ryzen 7000 series, ranging from Ryzen 5 7600X to Ryzen 9 7950X, were launched on September 27, 2022. The L2 cache per core

6363-464: The codename Genesis . In contrast to their CPU counterparts, the APUs consist of single dies with integrated graphics and smaller caches. The APUs, codenamed Cezanne, forgo PCIe 4.0 support to keep power consumption low. The 5000 series includes models based on the Zen 2 microarchitecture (codename Lucienne ) and Zen 3 microarchitecture. The codenames of the Zen 3 -based mobile APUs are Cezanne for

6464-528: The cores. The cores running hotter thus limited the clock frequencies of 7000X3D series processors, compared to their non-X3D counterparts. The engineers refuted earlier speculation that the temperature of the V-Cache had instead been the limiting factor. The Ryzen 7000 mobile series initially launched in September 2022 with the Ryzen 7020 Mendocino line of low-end Zen 2 ultra mobile processors. In early 2023,

6565-406: The depth of the pipeline increases with it, and some modern processors may have 20 stages or more. On average, every fifth instruction executed is a branch, so without any intervention, that's a high amount of stalling. Techniques such as branch prediction and speculative execution are used to lessen these branch penalties. Branch prediction is where the hardware makes educated guesses on whether

6666-490: The desktop parts. Fabricated at GlobalFoundries , this gives Picasso an aggregate 10 percent performance uplift from the "original" 14 nm Zen-based Raven Ridge series initially released in 2017. In 2019, AMD first released the Ryzen 3000 APUs, consisting only of quad core parts. Then in January 2020, they announced value dual-core mobile parts, codenamed Dalí, including the Ryzen 3 3250U and lower-end Athlon -branded parts. The Ryzen 4000 APUs are based on Renoir,

6767-399: The die, and designers started looking for ways to use it. One of the most common was to add an ever-increasing amount of cache memory on-die. Cache is very fast and expensive memory. It can be accessed in a few cycles as opposed to many needed to "talk" to main memory. The CPU includes a cache controller which automates reading and writing from the cache. If the data is already in the cache it

6868-434: The falling edge of the first cycle, etc. In the control logic, the combination of cycle counter, cycle state (high or low) and the bits of the instruction decode register determine exactly what each part of the computer should be doing. To design the control logic, one can create a table of bits describing the control signals to each part of the computer in each cycle of each instruction. Then, this logic table can be tested in

6969-514: The first of several generations. The 1000 series featured up to eight cores and sixteen threads, with a +52 percent instructions per cycle (IPC) increase over their prior CPU products, namely AMD's previous Excavator microarchitecture. The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture. The aggregate performance increased +10 percent (of which approximately +3 percent

7070-511: The first time. Zen 3 with 3D V-Cache was officially previewed on May 31, 2021. It differs from Zen 3 in that it includes 3D-stacked L3 cache on top of the normal L3 cache in the CCD, providing a total of 96 MB. The first product that uses it, the Ryzen 7 5800X3D , was released on April 20, 2022. The added cache brings an approximately 15% performance increase in gaming applications on average. Zen 3 with 3D V-Cache for server, codenamed Milan-X,

7171-414: The instruction process and making them take the same amount of time—one cycle. The processor as a whole operates in an assembly line fashion, with instructions coming in one side and results out the other. Due to the reduced complexity of the classic RISC pipeline , the pipelined core and an instruction cache could be placed on the same size die that would otherwise fit the core alone on a CISC design. This

7272-422: The large transistor counts and high operating frequencies needed for the more advanced ILP techniques required power dissipation levels that could no longer be cheaply cooled. For these reasons, newer generations of computers have started to exploit higher levels of parallelism that exist outside of a single program or program thread . This trend is sometimes known as throughput computing . This idea originated in

7373-406: The least total number of logic elements and reasonable amounts of power. They can be designed to have deterministic timing and high reliability. In particular, they have no pipeline to stall when taking conditional branches or interrupts. However, other microarchitectures often perform more instructions per unit time, using the same logic family. When discussing "improved performance," an improvement

7474-403: The limits of what could be reliably manufactured. By the late 1980s, superscalar designs started to enter the market place. In modern designs it is common to find two load units, one store (many instructions have no results to store), two or more integer math units, two or more floating point units, and often a SIMD unit of some sort. The instruction issue logic grows in complexity by reading in

7575-407: The machine do more operations simultaneously. Each microarchitectural element is in turn represented by a schematic describing the interconnections of logic gates used to implement it. Each logic gate is in turn represented by a circuit diagram describing the connections of the transistors used to implement it in some particular logic family . Machines with different microarchitectures may have

7676-413: The mainframe market where online transaction processing emphasized not just the execution speed of one transaction, but the capacity to deal with massive numbers of transactions. With transaction-based applications such as network routing and web-site serving greatly increasing in the last decade, the computer industry has re-emphasized capacity and throughput issues. One technique of how this parallelism

7777-506: The memory controllers, the fabric to enable core to core communication, and the bulk of uncore functions. The IO die used by Matisse processors is a small chip produced on GF 12 nm, whereas the server IO die utilized for Threadripper and Epyc is far larger. The server IO die is able to serve as a hub to connect up to eight 8-core chiplets, while the IO die for Matisse is able to connect up to two 8-core chiplets. These chiplets are linked by AMD's own second generation Infinity Fabric, allowing

7878-518: The most area-constrained embedded processors. Large CISC machines, from the VAX 8800 to the modern Pentium 4 and Athlon, are implemented with both microcode and pipelines. Improvements in pipelining and caching are the two major microarchitectural advances that have enabled processor performance to keep pace with the circuit technology on which they are based. It was not long before improvements in chip manufacturing allowed for even more circuitry to be placed on

7979-618: The new Wraith Prism cooler. In January 2018, AMD announced the first two Ryzen desktop APUs with integrated Radeon Vega graphics under the Raven Ridge codename. These are based on first generation Zen architecture. The Ryzen 3 2200G and the Ryzen 5 2400G were released in February. In May 2017, AMD demonstrated a Ryzen mobile APU with four Zen CPU cores and Radeon Vega GPU. The first Ryzen mobile APUs, codenamed Raven Ridge, were officially released in October 2017. In February 2018 AMD announced

8080-402: The newly released EPYC Milan-X line, organized in multiple levels of a memory hierarchy . Generally speaking, more cache means more performance, due to reduced stalling. Caches and pipelines were a perfect match for each other. Previously, it didn't make much sense to build a pipeline that could run faster than the access latency of off-chip memory. Using on-chip cache memory instead, meant that

8181-471: The other set, but if the other set is assigned to a different similar register, both sets of instructions can be executed in parallel (or) in series. Computer architects have become stymied by the growing mismatch in CPU operating frequencies and DRAM access times. None of the techniques that exploited instruction-level parallelism (ILP) within one program could make up for the long stalls that occurred when data had to be fetched from main memory. Additionally,

8282-399: The outline above the processor processes parts of a single instruction at a time. Computer programs could be executed faster if multiple instructions were processed simultaneously. This is what superscalar processors achieve, by replicating functional units such as ALUs. The replication of functional units was only made possible when the die area of a single-issue processor no longer stretched

8383-420: The pipeline as conditional branches depend on results coming from a register. From the time that the processor's instruction decoder has figured out that it has encountered a conditional branch instruction to the time that the deciding register value can be read out, the pipeline needs to be stalled for several cycles, or if it's not and the branch is taken, the pipeline needs to be flushed. As clock speeds increase

8484-464: The prior-generation Bulldozer AMD core, without raising electrical power use. The changes to the instruction set architecture also adds binary-code compatibility to AMD's CPU. Since the release of Ryzen, AMD's CPU market share has increased while Intel's appears to have stagnated and/or regressed. AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017,

8585-523: The processor at the same time. In the same basic example, the processor would start to decode (step 1) a new instruction while the last one was waiting for results. This would allow up to four instructions to be "in flight" at one time, making the processor look four times as fast. Although any one instruction takes just as long to complete (there are still four steps) the CPU as a whole "retires" instructions much faster. RISC makes pipelines smaller and much easier to construct by cleanly separating each stage of

8686-402: The rest of the Ryzen 7000 mobile lineup was released, starting with Ryzen 7030, Ryzen 7035, and later Ryzen 7045 and Ryzen 7040 series processors. The Ryzen 7020 series targets the "everyday computing" segment. It is a new Zen 2 design based on 6 nm process and RDNA 2 integrated graphics. The Ryzen 7030 series is a refresh of Ryzen 5000 series processors codenamed "Barcelo-R", targeting

8787-557: The same I/O die. Desktop and mobile APUs are based on the Picasso microarchitecture, a 12 nm refresh of Raven Ridge, offering a modest (6 percent) increase in clock speeds (up to an additional 300 MHz maximum boost), Precision Boost 2, an up-to-3-percent increase in IPC from the move to the Zen+ core with its reduced cache and memory latencies, and newly added solder thermal interface material for

8888-590: The same cycle. Ryzen 7000 Ryzen ( / ˈ r aɪ z ən / , RY -zən ) is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture . It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications. A majority of AMD's consumer Ryzen products use

8989-404: The same instruction set architecture, and thus be capable of executing the same programs. New microarchitectures and/or circuitry solutions, along with advances in semiconductor manufacturing, are what allows newer generations of processors to achieve higher performance while using the same ISA. In principle, a single microarchitecture could execute several different ISAs with only minor changes to

9090-509: The same silicon chip. Initially used in chips targeting embedded markets, where simpler and smaller CPUs would allow multiple instantiations to fit on one piece of silicon. By 2005, semiconductor technology allowed dual high-end desktop CPUs CMP chips to be manufactured in volume. Some designs, such as Sun Microsystems ' UltraSPARC T1 have reverted to simpler (scalar, in-order) designs in order to fit more processors on one piece of silicon. Another technique that has become more popular recently

9191-549: The system are also microarchitectural decisions. System-level design decisions such as whether or not to include peripherals , such as memory controllers , can be considered part of the microarchitectural design process. This includes decisions on the performance-level and connectivity of these peripherals. Unlike architectural design, where achieving a specific performance level is the main goal, microarchitectural design pays closer attention to other constraints. Since microarchitecture design decisions directly affect what goes into

9292-411: The workstation-oriented Intel Xeon W-3275 and W-3275M , has 28 cores, 56 threads, and cost more when launched. The 4, 6 and 8 core processors have one core chiplet. The 12 and 16 core processors have two core chiplets. In all cases the I/O die is the same. The Threadripper 24 and 32 core processors have four core chiplets. The 64 core processor has eight core chiplets. All Threadripper processors use

9393-455: The years, a central goal was to execute more instructions in parallel, thus increasing the effective execution speed of a program. These efforts introduced complicated logic and circuit structures. Initially, these techniques could only be implemented on expensive mainframes or supercomputers due to the amount of circuitry needed for these techniques. As semiconductor manufacturing progressed, more and more of these techniques could be implemented on

9494-466: Was IPC and +6 percent was clock frequency). Most importantly, Zen+ fixed the cache and memory latencies that had been major weak points. The third generation of Ryzen processors launched on July 7, 2019, based on AMD's Zen 2 architecture, featuring significant design improvements with a +15 percent average IPC boost, a doubling of floating point capability to a full 256-bit-wide execution data path much like Intel 's Haswell released in 2014,

9595-525: Was announced affecting all Zen-based processors to that date. Sinkclose affects the System Management Mode (SMM). It can only be exploited by first compromising the operating system kernel . Once effected, it is possible to avoid detection by antivirus software and even compromise a system after the operating system has been re-installed. AMD followed up with patches to be released on August 20, 2024. Microarchitecture Computer architecture

9696-464: Was announced in AMD's Accelerated Data Center Premiere Keynote on November 8, 2021. It brings a 50% increase in select datacenter applications over Zen 3's Milan CPUs while maintaining socket compatibility with them. Milan-X was released on March 21, 2022. Epyc server CPUs with Zen 4 , codenamed Genoa, were officially unveiled at AMD's Accelerated Data Center Premiere Keynote on November 8, 2021, and released

9797-543: Was demonstrated at E3 2016 , and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs reached the market in early March 2017, and Zen-derived Epyc server processors (codenamed "Naples") launched in June 2017 and Zen-based APUs (codenamed "Raven Ridge") arrived in November 2017. This first iteration of Zen utilized GlobalFoundries ' 14 nm manufacturing process. Modified Zen-based processors for

9898-399: Was most famous for alternating between a new CPU microarchitecture and a new fabrication node each year. Intel followed that release cadence for almost a decade, starting with Intel Core's initial Q3 2006 launch of 65 nm Conroe and continuing until the release of the 14 nm Broadwell desktop CPUs, which were delayed a year from a planned 2014 launch to Q3 2015. That delay necessitated

9999-410: Was released September 27, 2022 for desktops, featuring the new Zen 4 core with a +13 percent uplift in IPC and +15 percent increase in frequency for a claimed nearly +30 percent in single thread performance. The Ryzen 7000 series also features a brand new AM5 socket and uses DDR5 memory. In mid 2024, AMD confirms to announce a new grounds-up redesign of Ryzen named "Zen 5" stemming from

10100-560: Was the real reason that RISC was faster. Early designs like the SPARC and MIPS often ran over 10 times as fast as Intel and Motorola CISC solutions at the same clock speed and price. Pipelines are by no means limited to RISC designs. By 1986 the top-of-the-line VAX implementation ( VAX 8800 ) was a heavily pipelined design, slightly predating the first commercial MIPS and SPARC designs. Most modern CPUs (even embedded CPUs) are now pipelined, and microcoded CPUs with no pipelining are seen only in

10201-450: Was uncompetitive with AMD's Athlon XP in terms of price and efficiency, and with Athlon 64 & 64 X2 they were outmatched in terms of raw performance as well. Until Ryzen's initial launch in early 2017, Intel's market dominance over AMD continued to grow with the launch of the now famous "Intel Core" CPU lineup and branding, as well as the successful rollout of their now well-known "tick-tock" CPU release strategy. That new strategy

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